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Cited by 150Trace Elements in HealthWound Healing and TreatmentsNanoparticles: synthesis and applications

The DOI matches its Crossref record; 99 of the 99 references it cites were found in a registry or an index.

Using Copper to Improve the Well-Being of the Skin

Open access
Borkow, Gadi·2015·Current Chemical Biology
DOI 10.2174/2212796809666150227223857PMC PMC4556990
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Abstract

Copper has two key properties that are being exploited in consumer and medical device products in the last decade. On the one hand, copper has potent biocidal properties. On the other hand, copper is involved in numerous physiological and metabolic processes critical for the appropriate functioning of almost all tissues in the human body. In the skin, copper is involved in the synthesis and stabilization of extracellular matrix skin proteins and angiogenesis. This manuscript reviews clinical studies that show that the use of textile consumer and medical device products, embedded with microscopic copper oxide particles, improve the well-being of the skin. These include studies showing a) cure of athlete's foot infections and improvement in skin elasticity, especially important for individuals suffering from diabetes; b) reduction of facial fine line and wrinkles; and c) enhancement of wound healing; by copper oxide embedded socks, pillowcases and wound dressings, respectively. The manuscript also reviews and discusses the mechanisms by which the presence of copper in these products improves skin well-being.

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Figures

Fig. (1) Stimulation of Fibroblast proliferation by Copper. Fibroblasts were exposed to 0–100 µM copper for 24 hr. The cells were examined for proliferation by MTS assay. Effects are represented as absorbance units; * = p < 0.05, relative to control (0 Cu2+). Error bars represent standard deviation, n = 4. Data taken from [26].
Fig. (1) Stimulation of Fibroblast proliferation by Copper. Fibroblasts were exposed to 0–100 µM copper for 24 hr. The cells were examined for proliferation by MTS assay. Effects are represented as absorbance units; * = p < 0.05, relative to control (0 Cu2+). Error bars represent standard deviation, n = 4. Data taken from [26].CC BY-NC · PubMed Central
Fig. (2) Upregulation of Fibrillar Collagens Secretion from Fibroblast by copper. Fibroblasts were dosed with 0, 0.05, 0.3, or 0.5 nM copper for 24 hr and examined for type I, type III and type V collagen protein levels. *p < 0.05 relative to control; Error bars represent standard deviation, n = 4. Data taken from [27].
Fig. (2) Upregulation of Fibrillar Collagens Secretion from Fibroblast by copper. Fibroblasts were dosed with 0, 0.05, 0.3, or 0.5 nM copper for 24 hr and examined for type I, type III and type V collagen protein levels. *p < 0.05 relative to control; Error bars represent standard deviation, n = 4. Data taken from [27].CC BY-NC · PubMed Central
Fig. (3) Antibacterial and antifungal efficacy of Cu, Cu++ and Cu+ ions. A) Staphylococcus aureus bacteria were homogenously plated in agar plates, followed by the addition of Cu, CuO and Cu2O particles (in strips). After 24 hours of culture at 37°C the bacteria formed colonies (beige areas). Notice no growth of bacteria especially around the strip of Cu2O particles; B) Cu, CuO and Cu2O particles (in strips) were added to agar plates. A Trichophyton rubrum colony was plated at the side of the plate. The pictures show the growth of the fungi after 4 days of culture at 37°C. plates without copper served as a negative control. Notice the inhibition of growth of the fungi especially when exposed to the cuprous particles. Experiment was conducted in duplicates.
Fig. (3) Antibacterial and antifungal efficacy of Cu, Cu++ and Cu+ ions. A) Staphylococcus aureus bacteria were homogenously plated in agar plates, followed by the addition of Cu, CuO and Cu2O particles (in strips). After 24 hours of culture at 37°C the bacteria formed colonies (beige areas). Notice no growth of bacteria especially around the strip of Cu2O particles; B) Cu, CuO and Cu2O particles (in strips) were added to agar plates. A Trichophyton rubrum colony was plated at the side of the plate. The pictures show the growth of the fungi after 4 days of culture at 37°C. plates without copper served as a negative control. Notice the inhibition of growth of the fungi especially when exposed to the cuprous particles. Experiment was conducted in duplicates.CC BY-NC · PubMed Central
Fig. (4) Scanning electronic microscope pictures of non-woven, woven and plastic plate containing the copper oxide particles. The white dots are the copper oxide particles embedded in the polymeric matrices. For more detailed information please see references [52, 83].
Fig. (4) Scanning electronic microscope pictures of non-woven, woven and plastic plate containing the copper oxide particles. The white dots are the copper oxide particles embedded in the polymeric matrices. For more detailed information please see references [52, 83].CC BY-NC · PubMed Central
Fig. (5) Representative pictures (A) and 3D images (B) data analysis showing reduction of fine lines in the group of individuals using the copper oxide containing pillowcases. pictures and data taken from references [87, 88]. 1Decrement of the mean value represents improvement of skin wrinkles (▼). *Statistically significant difference compare to before treatment (p<0.05).
Fig. (5) Representative pictures (A) and 3D images (B) data analysis showing reduction of fine lines in the group of individuals using the copper oxide containing pillowcases. pictures and data taken from references [87, 88]. 1Decrement of the mean value represents improvement of skin wrinkles (▼). *Statistically significant difference compare to before treatment (p<0.05).CC BY-NC · PubMed Central
Fig. (6) Representative pictures showing improvement in the foot skin well-being after using the copper oxide impregnated socks for 12 days. pictures taken from reference [54].
Fig. (6) Representative pictures showing improvement in the foot skin well-being after using the copper oxide impregnated socks for 12 days. pictures taken from reference [54].CC BY-NC · PubMed Central
Fig. (7) Increased skin surface elasticity following the use of copper oxide containing socks. Using copper oxide containing socks for at least 10 h a day for 4 weeks resulted in 31.4% increased net skin elasticity (R5)(p = 0.004) and 20.7% increased mean biological elasticity (R7) (p=0.014). Data is taken from [94].
Fig. (7) Increased skin surface elasticity following the use of copper oxide containing socks. Using copper oxide containing socks for at least 10 h a day for 4 weeks resulted in 31.4% increased net skin elasticity (R5)(p = 0.004) and 20.7% increased mean biological elasticity (R7) (p=0.014). Data is taken from [94].CC BY-NC · PubMed Central
Fig. (8) Improved wound healing. Following wounding and treatment with copper oxide containing wound dressings there is a) normal skin regeneration (histological analysis after 17 days of wounding) and b) upregulation of angiogenic related factors, such as Vascular Endothelial Growth Factor (VEGF) – Immuno-histological analysis. Arrows show VEGF specific staining. For comparative data to control treated mice and other details, please see reference [38].
Fig. (8) Improved wound healing. Following wounding and treatment with copper oxide containing wound dressings there is a) normal skin regeneration (histological analysis after 17 days of wounding) and b) upregulation of angiogenic related factors, such as Vascular Endothelial Growth Factor (VEGF) – Immuno-histological analysis. Arrows show VEGF specific staining. For comparative data to control treated mice and other details, please see reference [38].CC BY-NC · PubMed Central
Fig. (9) Increased expression of angiogenic factors and other proteins involved in wound healing. Significant and differential upregulation of mRNA expression of key proteins involved in the wound healing process in the group of mice treated with the copper oxide wound dressings as compared to mice treated with control wound dressing without copper. Itgav - Integrin alpha V; and Itgb3 - Integrin beta 3. Data taken from reference [38].
Fig. (9) Increased expression of angiogenic factors and other proteins involved in wound healing. Significant and differential upregulation of mRNA expression of key proteins involved in the wound healing process in the group of mice treated with the copper oxide wound dressings as compared to mice treated with control wound dressing without copper. Itgav - Integrin alpha V; and Itgb3 - Integrin beta 3. Data taken from reference [38].CC BY-NC · PubMed Central

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Metadata

Authors
Borkow, G.
Affiliations
Cupron (Israel) (IL)
Corresponding author
Borkow, Gadi
ORCID
Borkow, Gadi
Venue
Current Chemical Biology
Publisher
Bentham Science Publishers Ltd.
Published
2015-04-06
Volume
8
Issue
2
Pages
89-102
ISSN
  • 1872-3136 (ISSN-L)
  • 2212-7968
DOI
10.2174/2212796809666150227223857
PMC
PMC4556990
OpenAlex
W2320500762
Cited by
149
References
97
Citations by year
2026: 10 · 2025: 28 · 2024: 21 · 2023: 19 · 2022: 24 · 2021: 12 · 2020: 12 · 2019: 10 · 2018: 6 · 2017: 5 · 2016: 2
FWCI
4.17
Type
journal article
Language
en
Open access
Locations
  • Current Chemical Biology (publishedVersion)
  • Europe PMC (PubMed Central) (publishedVersion, cc-by-nc)
  • PubMed Central (publishedVersion, cc-by-nc)
  • PubMed (publishedVersion)
Topics
  • Health Sciences › Nursing › Nutrition and Dietetics › Trace Elements in Health
  • Health Sciences › Medicine › Surgery › Wound Healing and Treatments
  • Physical Sciences › Materials Science › Materials Chemistry › Nanoparticles: synthesis and applications
Keywords
copper, copper oxide, biocidal properties, extracellular matrix proteins, angiogenesis, tinea pedis, skin elasticity, diabetes mellitus, wrinkles, wound healing, wound dressings, medical devices

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