Cited by 354Nanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsAdvanced Materials and Mechanics

Experimental and Theoretical Studies of Serpentine Microstructures Bonded To Prestrained Elastomers for Stretchable Electronics

Zhang, Yihui, Wang, Shuodao, Li, Xuetong, Fan, Jonathan A., Xu, Sheng, Song, Young Min, Choi, Ki‐Joong, Yeo, Woon‐Hong +7 more·2014·Advanced Functional Materials

Abstract

Stretchable electronic devices that exploit inorganic materials are attractive due to their combination of high performance with mechanical deformability, particularly for applications in biomedical devices that require intimate integration with human body. Several mechanics and materials schemes have been devised for this type of technology, many of which exploit deformable interconnects. When such interconnects are fully bonded to the substrate and/or encapsulated in a solid material, useful but modest levels of deformation (<30–40%) are possible, with reversible and repeatable mechanics. Here, the use of prestrain in the substrate is introduced, together with interconnects in narrow, serpentine shapes, to yield significantly enhanced (more than two times) stretchability, to more than 100%. Fracture and cyclic fatigue testing on structures formed with and without prestrain quantitatively demonstrate the possible enhancements. Finite element analyses (FEA) illustrates the effects of various material and geometric parameters. A drastic decrease in the elastic stretchability is observed with increasing metal thickness, due to changes in the buckling mode, that is, from local wrinkling at small thicknesses to absence of such wrinkling at large thicknesses, as revealed by experiment. An analytic model quantitatively predicts the wavelength of this wrinkling, and explains the thickness dependence of the buckling behaviors.

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Crossref · 10.1002/adfm.201302957

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42 of 42 references verified0 citation errors · 0 not checkable

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  • The EA value of the twining electrodes is 0.08 N, while traditional silicone rubber- and PI-based extraneural electrodes have EA values of ~5000 and 40 N, respectively.

    “By taking advantage of the mesh serpentine design (44–46), the EA value is greatly decreased to 0.08 N (fig. S8); comparatively, the EA values of traditional silicone rubber– and PI-based extraneural electrodes are ~5000 and 40 N, respectively (note S3).”
  • The applied stresses on the nerve and the reliability of the Au layer can be further improved by increasing the stretchability of the twining electrode.

    “In addition, the applied stresses on the nerve and the reliability of the Au layer can be further improved by increasing the stretchability of the twining electrode according to previous works (44–47).”

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Authors
Zhang, Y., Wang, S., Li, X., Fan, J. A., Xu, S., Song, Y. M., Choi, K., Yeo, W., Lee, W., Nazaar, S. N., Lu, B., Yin, L., Hwang, K., Rogers, J. A., & Huang, Y.
Affiliations
  • Northwestern University (US)
  • University of Illinois Urbana-Champaign (US)
  • Tsinghua University (CN)
Corresponding author
  • Rogers, John A.
  • Huang, Yonggang
Venue
Advanced Functional Materials
Publisher
Wiley
Published
2013-11-26
Volume
24
Issue
14
Pages
2028-2037
ISSN
  • 1616-301X (ISSN-L)
  • 1616-3028
OpenAlex
W2109532363
Cited by
354
References
43
Citations by year
2026: 26 · 2025: 25 · 2024: 27 · 2023: 32 · 2022: 37 · 2021: 29 · 2020: 35 · 2019: 36 · 2018: 36 · 2017: 24 · 2016: 22 · 2015: 20 · 2014: 5
FWCI
9.40
Type
journal article
Language
en
Open access
closed
Locations
Advanced Functional Materials (publishedVersion)
Funders
  • National Science Foundation
  • National Natural Science Foundation of China
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Nanomaterials and Printing Technologies
  • Physical Sciences › Engineering › Biomedical Engineering › Advanced Sensor and Energy Harvesting Materials
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Materials and Mechanics
Keywords
stretchable electronics, metal interconnects, wrinkling, buckling, cyclic fatigue, fracture, finite element analysis, biomedical devices

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