The DOI matches its Crossref record; 125 of the 135 references it cites were found in a registry or an index.
Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
Open accessAbstract
Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“According to [238], [239], power semiconductor device damages account for approximately 35% of all ASD faults.”
From Fault Diagnosis and Fault-Tolerant Control of PMSM Drives–State of the Art and Future Challenges (2022) · cites this paper as [238]
Citations
Cites
Physics of Semiconductor Devices
Sze, S. M., & Ng, K. K. (2006) · doi:10.1002/0470068329 · Cited by 14,627
Physics of Semiconductor Devices
Colinge, J.-P., & Colinge, C. (2002) · Kluwer Academic Publishers eBooks · doi:10.1007/b117561 · Cited by 14,074
A Critical Analysis of Crack Propagation Laws
Paris, P. C., & Erdoğan, F. (1963) · Journal of Basic Engineering · doi:10.1115/1.3656900 · Cited by 7,168
Power electronics converters, applications and design
Robinson, F. V. P. (1997) · Microelectronics Journal · doi:10.1016/s0026-2692(97)87859-7 · Cited by 5,100
Power Electronics: Converters, Applications and Design
Mohan, N., Undeland, T. M., & Robbins, W. P. (1989) · Cited by 4,781
Fundamentals of Power Semiconductor Devices
Baliga, B. J. (2008) · Springer eBooks · doi:10.1007/978-0-387-47314-7 · Cited by 2,241
An Industry-Based Survey of Reliability in Power Electronic Converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058
Self-citationSelected failure mechanisms of modern power modules
Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039
Power Electronics: Converters, Applications, and Design
Mohan (2007) · Cited by 1,022
(2002) · Elsevier eBooks · doi:10.1016/c2016-0-00847-1 · Cited by 940
Research works printed but not linked: 10
- grant, 1989, Power MOSFET-Theory and Applications
- scheuermann, 2002, power cycling lifetime of advanced power modules for different temperature swings, Proc Power Convers Intell Motion, 59
- mermet-guyennet, 2008, Reliability requirement for traction power converters, ECPE Workshop Built-in Rel Power Electron Syst
- wolfgang, 2007, Examples for failures in power electronics systems, ECPE Tutorial Rel Power Electron Syst
- fratelli, 1999, reliability test of power igbt's for railway traction, Proc Eur Conf Power Electron Appl
- ramminger, 2006, predicting the crack progression in pbsnag-solder under cyclic loading conditions, Int Conf Integr Power Syst
- agyakwa, 2008, anomalous reliability behaviour of 99.99% and 99.999% pure aluminium wire bonds under thermal cycling, Proc IMAPS 41st Int Symp Microelectron
- dunipace, 2008, test saturation voltage to achieve high efficiency, Power Electron Technol, 32
- coquery, 1999, reliability improvement of the soldering thermal fatigue with alsic technology on traction high-power igbt modules, Proc Eur Conf Power Electron Appl
- 10.1109/63.704154 · DOI
Cited by
Sorted by citations
Items 501–600 of 1,000
Monitoring Power Module Solder Degradation From Heat Dissipation in Two Opposite Directions
Hu, Z., Hu, B., Ran, L., Tavner, P., Kong, H., Mawby, P., & Wu, R. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3157464 · Cited by 14
Self-citationDriver Integrated Online Rds-on Monitoring Method for SiC Power Converters
Chen, Z., Chen, C., & Huang, A. Q. (2022) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce50734.2022.9947617 · Cited by 14
Diagnostics and Prognostics Needs and Requirements for Electrified Vehicles Powertrains
Cordoba-Arenas, A., Zhang, J., & Rizzoni, G. (2013) · IFAC Proceedings Volumes · doi:10.3182/20130904-4-jp-2042.00139 · Cited by 14
Real field mission profile oriented design of a SiC-based PV-inverter application
Sintamarean, C., Blaabjerg, F., Wang, H., & Yang, Y. (2013) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2013.6646804 · Cited by 14
Failure analysis of solder layer in power transistor
Jiang, M., Fu, G., Wan, B. A., Xue, P., Qiu, Y., & Li, Y. (2017) · Soldering and Surface Mount Technology · doi:10.1108/ssmt-07-2017-0019 · Cited by 14
Lai, W., Chen, M., Ran, L., Xu, S., Pan, L., Alatise, O. M., & Mawby, P. (2018) · IEEJ Transactions on Electrical and Electronic Engineering · doi:10.1002/tee.22607 · Cited by 14
Self-citationAn Asymmetrical Power Module Design for Modular Multilevel Converter With Unidirectional Power Flow
Mao, H., Jiang, H., Ran, L., Hu, J., Qiu, G., Wei, J., Chen, H., Zhong, X., Xiao, N., Wang, L., et al. (2022) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3198859 · Cited by 14
Self-citationRoy, S., & Khan, F. (2018) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2018.8341051 · Cited by 13
Park, Y.-S., Choi, H.-W., Lee, K., & Lee, J.-W. (2022) · IEEE Access · doi:10.1109/access.2022.3191643 · Cited by 13
Fault Diagnosis and Tolerance on Reliability of Automotive Motor Control System: A Review
Choi, C., & Lee, W. (2022) · International Journal of Automotive Technology · doi:10.1007/s12239-022-0102-2 · Cited by 13
Lima, A. A. D. M., Souza, F. A. A., Morais, E. E. C., Honório, D. D. A., & Barreto, L. H. S. C. (2022) · Workshop on Communication Networks and Power Systems (WCNPS) · doi:10.1109/wcnps56355.2022.9969681 · Cited by 13
Reliability evaluation of a novel fault tolerant multilevel inverter with reduced components
Dewangan, N. K., Verma, D., Agrawal, R., Kumar, D., & Gupta, K. K. (2023) · Electrical Engineering · doi:10.1007/s00202-023-01744-3 · Cited by 13
Wang, S., Ju, Y., Fu, C., Xie, P., & Cheng, C. (2024) · IEEE Transactions on Instrumentation and Measurement · doi:10.1109/tim.2023.3348900 · Cited by 14
Study on power converters used in hybrid vehicles with monitoring and diagnostics techniques
Sheikh, H. A., Bennouna, O., Hoblos, G., & Moubayed, N. (2014) · IEEE Mediterranean Electrotechnical Conference (MELECON) · doi:10.1109/melcon.2014.6820515 · Cited by 13
Advanced power cycling test for power module with on-line on-state VCE measurement
Choi, U., Trintis, I., Blaabjerg, F., Jorgensen, S., & Svarre, M. L. (2015) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2015.7104765 · Cited by 13
Fault‐tolerant switched capacitor–based boost multilevel inverter
Ajaykumar, T., & Patne, N. R. (2019) · International Journal of Circuit Theory and Applications · doi:10.1002/cta.2671 · Cited by 13
Kim, Y.-J., Kim, S.-H., Kim, S., & Lee, K. (2020) · IEEE Access · doi:10.1109/access.2020.3013566 · Cited by 13
Ni, K., Gan, C., Hu, Y., Lagos, D., Qu, R., & Hatziargyriou, N. D. (2020) · IEEE Transactions on Transportation Electrification · doi:10.1109/tte.2020.3039355 · Cited by 13
Power Devices Health Condition Monitoring: A Review of Recent Papers
Foube, F. (2021) · PHM Society European Conference · doi:10.36001/phme.2021.v6i1.2808 · Cited by 13
Qi, L., Wang, M., Zhang, X., Shen, H., Wang, H., & Jiao, C. (2022) · High Voltage · doi:10.1049/hve2.12227 · Cited by 13
Rolling Average-Decision Tree-Based Fault Detection of Neutral Point Clamped Inverters
Valiyil, R., & Jagadanand, G. (2023) · IEEE Journal of Emerging and Selected Topics in Industrial Electronics · doi:10.1109/jestie.2023.3236587 · Cited by 14
In-situ Bond Wire and Solder Layer Health Monitoring Circuit for IGBT Power Modules
Ji, B., Pickert, V., & Zahawi, B. (2012) · Cited by 13
Study on case temperature distribution for condition monitoring of multidie IGBT modules
Tian, B., Wang, Z., & Qiao, W. (2014) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2014.6803664 · Cited by 13
Power electronics in renewable energy smart grid: a review
Bayoumi, E. H. E. (2015) · International Journal of Industrial Electronics and Drives · doi:10.1504/ijied.2015.068769 · Cited by 13
Gadalla, B., Schaltz, E., Siwakoti, Y. P., & Blaabjerg, F. (2016) · IEEE International Conference on Environment and Electrical Engineering and IEEE Industrial and Commercial Power Systems Europe (EEEIC / I&CPS Europe) · doi:10.1109/eeeic.2016.7555610 · Cited by 13
Control of IGBT junction temperature in small-scale wind power converter
Wu, J., Zhou, L., Sun, P., & Du, X. (2014) · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · doi:10.1109/peac.2014.7037826 · Cited by 13
Real-time aging monitoring for power MOSFETs using threshold voltage
Ren, L., Shen, Q., & Gong, C. (2016) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2016.7793625 · Cited by 13
A Study on Passive Cooling in Subsea Power Electronics
Wani, F., Shipurkar, U., Dong, J., & Polinder, H. (2018) · IEEE Access · doi:10.1109/access.2018.2879273 · Cited by 13
Chowdhury, V. R., & Kimball, J. W. (2019) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2019.8912226 · Cited by 13
Parameter Identification of DC ‐Link Capacitor for Electric Vehicle Based on IGWO‐BP Neural Network
Yao, F., Dong, C., Tang, S., & He, W. (2021) · IEEJ Transactions on Electrical and Electronic Engineering · doi:10.1002/tee.23373 · Cited by 13
Iosifidis, N., Zhong, Y., Hu, B., Chen, B., Ran, L., Lakshminarayana, S., Jia, C., Mckeever, P., & Ng, C. (2021) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce47101.2021.9595095 · Cited by 12
Self-citationSonawane, V., & Patil, S. B. (2023) · Advances in Engineering Software · doi:10.1016/j.advengsoft.2023.103414 · Cited by 12
Cross-domain health status assessment of three-phase inverters using improved DANN
Sun, Q. H., Peng, F., Li, H., Huang, J., & Sun, G. (2023) · Journal of Power Electronics · doi:10.1007/s43236-023-00623-1 · Cited by 12
Du, Y., Tao, T., Zhao, X., Zhao, W., Ji, J., & Li, Z. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3422218 · Cited by 12
Boettcher, M., Reese, J., & Fuchs, F. W. (2013) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2013.6699307 · Cited by 12
A Simple Closed-Loop Active Gate Voltage Driver for Controlling diC/dt and dvCE/dt in IGBTs
Ghorbani, H., Sala, V., Paredes, A., & Romeral, L. (2019) · Electronics · doi:10.3390/electronics8020144 · Cited by 12
Remaining Useful Life Prediction of Power MOSFETs Using Model-Based and Data-Driven Methods
Wu, J., Xu, Z., & Wei, X. (2019) · Advances in intelligent systems and computing · doi:10.1007/978-3-030-15235-2_56 · Cited by 12
Ni, K., Gan, C., Peng, G., Hu, Y., & Qu, R. (2021) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2021.3058607 · Cited by 12
Study on Heat Dissipation and Cooling Optimization of the Junction Box of OBSEA Seafloor Observatory
Toma, D. M., Lázaro, A. M., Nogueras, M., & Fernández, J. D. R. (2014) · IEEE/ASME Transactions on Mechatronics · doi:10.1109/tmech.2014.2336791 · Cited by 12
Estima, J. O., & Cardoso, A. J. M. (2012) · International Conference on Electrical Machines (ICEM) · doi:10.1109/icelmach.2012.6350221 · Cited by 12
Gadalla, B., Schaltz, E., Siwakoti, Y. P., & Blaabjerg, F. (2016) · Transactions on Environment and Electrical Engineering · doi:10.22149/teee.v2i1.68 · Cited by 12
Ali, S. H., Düşmez, S., & Akin, B. (2016) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2016.7854665 · Cited by 12
Hong, J., Lee, S. B., Kral, C., & Haumer, A. (2011) · IEEE International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED) · doi:10.1109/demped.2011.6063651 · Cited by 12
Reliability assessment of two-phase interleaved boost converter
Umarani, D., & Seyezhai, R. (2018) · Life Cycle Reliability and Safety Engineering · doi:10.1007/s41872-018-0043-y · Cited by 12
Effect of short circuit aging on safe operating area of SiC MOSFET
Nguyen, T. A., Lefebvre, S., & Azzopardi, S. (2018) · Microelectronics Reliability · doi:10.1016/j.microrel.2018.06.040 · Cited by 12
Adaptive Weighted VMD-WPEE Method of Power-Electronic-Circuit Multiple-Parameter-Fault Diagnosis
Jiang, Y., Chen, L., Zeng, W., & Xin, Y. (2019) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2930306 · Cited by 12
Remaining Useful Life Prediction of an IGBT Module in Electric Vehicles Statistical Analysis
Wu, H., Ye, C., Zhang, Y., Nie, J., Kuang, Y., & Li, Z. (2020) · Symmetry · doi:10.3390/sym12081325 · Cited by 12
Challenges and New Trends in Power Electronic Devices Reliability
Chiodo, E., Falco, P. D., & Noia, L. P. D. (2021) · Electronics · doi:10.3390/electronics10080925 · Cited by 12
Liu, L., Shi, L., Peng, J., Bang, J., Liu, S., Liu, C., & Chen, Z. (2022) · Materials Research Bulletin · doi:10.1016/j.materresbull.2022.111854 · Cited by 12
Fault Tolerance for Wind Turbine Power Converter
Feng, Y., Zhou, J., Yingning, Q., & Feng, K. (2013) · Renewable Power Generation Conference (RPG) · doi:10.1049/cp.2013.1831 · Cited by 12
Advanced condition monitoring system based on on-line semiconductor loss measurements
Krone, T., Hung, L. D., Jung, M., & Mertens, A. (2016) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2016.7854828 · Cited by 12
Optimization and control of storage in smart grids
Hashmi, M. U. (2019) · doi:10.70675/3596afdaz3f86z4937z9655z65c809f26c9d · Cited by 12
Boztaş, G., & Tuncer, T. (2021) · Neural Computing and Applications · doi:10.1007/s00521-021-06534-1 · Cited by 11
Zhou, X., Hu, Q., Cui, P., Xu, X., & Mao, K. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2023.3281683 · Cited by 11
Solid-State Tuning Restorer for Second-Harmonic LC Filter in Single-Phase Converters
Mukhopadhyay, A., & John, V. (2023) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2023.3320109 · Cited by 11
Optimal phase change material integration strategies for maximizing electronic device reliability
Kim, S., Kim, H., King, W. P., & Miljkovic, N. (2025) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2025.125736 · Cited by 12
Kalay, M. Ş., & Akpolat, A. N. (2025) · IET Renewable Power Generation · doi:10.1049/rpg2.70111 · Cited by 16
Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, J., Myllykoski, P., & Paulasto‐Kröckel, M. (2015) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/eurosime.2015.7103076 · Cited by 11
Energy-based Fault Detection for an Autothermal Reformer
Marais, H., van Schoor, G., & Uren, K. R. (2016) · IFAC-PapersOnLine · doi:10.1016/j.ifacol.2016.07.325 · Cited by 11
Ni, K., Gan, C., Hu, Y., & Qu, R. (2020) · IEEE Transactions on Transportation Electrification · doi:10.1109/tte.2020.3044884 · Cited by 11
Qiu, G., Wu, F., Chen, K., & Wang, L. (2022) · Applied Sciences · doi:10.3390/app12042121 · Cited by 11
Real time monitoring of aging process in power converters using the SSTDR generated impedance matrix
Nasrin, M. S., & Khan, F. (2013) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2013.6520451 · Cited by 11
Rainflow algorithm based lifetime estimation of power semiconductors in utility applications
Reddy, L. G., Tolbert, L. M., Ozpineci, B., & Pinto, J. O. P. (2014) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2014.6803623 · Cited by 11
Condition Monitoring of Power Electronics for Offshore Wind
Ran, L., Mawby, P., Mckeever, P., & Konaklieva, S. (2014) · Engineering & Technology Reference · doi:10.1049/etr.2014.0004 · Cited by 11
Self-citationLi, Q., & Khan, F. (2014) · International Power Electronics Conference (IPEC) · doi:10.1109/ipec.2014.6869888 · Cited by 11
Carlos, G. A. D. A., Jacobina, C. B., & dos Santos, E. C. (2018) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2018.2798594 · Cited by 11
Self-healing Model Predictive Controlled Cascaded Multilevel Inverter
Easley, M., Baker, M., Khan, A., Shadmand, M. B., & Abu‐Rub, H. (2019) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2019.8913011 · Cited by 11
In situ thermal runaway of Si-based press-fit diodes monitored by infrared thermography
Moure, A., Román-Sánchez, S., Serrano, A., Lorite, I., & Fernández, J. F. (2020) · Results in Physics · doi:10.1016/j.rinp.2020.103529 · Cited by 11
Accelerated Testing and Reliability of FDM-Based Structural Electronics
Wałpuski, B., & Słoma, M. (2022) · Applied Sciences · doi:10.3390/app12031110 · Cited by 11
5D Analysis of Capacity Degradation in Battery Electrodes Enabled by Operando CT‐XANES
Kimura, Y., Huang, S., Nakamura, T., Ishiguro, N., Sekizawa, O., Nitta, K., Uruga, T., Takeuchi, T., Okumura, T., Tada, M., et al. (2023) · Small Methods · doi:10.1002/smtd.202300310 · Cited by 10
Ding, H., Ma, F., Han, R. G., Wang, L., & Wong, M. (2023) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2023.3333002 · Cited by 10
Chuang, T., Chen, Y.-T., Chen, Y.-H., Chu, C.-C., & Lin, C.-S. (2024) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2024.3380621 · Cited by 10
A Comparison of Chip Temperature Acquisition Technologies of IGBT Power Modules
Chen, S., Vilchis-Rodriguez, D. S., Barnes, M., & Djurović, S. (2024) · IEEE Sensors Journal · doi:10.1109/jsen.2024.3390600 · Cited by 10
Xu, H., Liu, Z., Jiang, D., Qu, R., & Tian, J. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3595437 · Cited by 10
Condition Monitoring of DC-link Capacitors in Grid-tied Solar Inverters Using Data-Driven Techniques
Seferian, V., Bazzi, A. M., & Hajj, H. M. (2020) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce44975.2020.9235764 · Cited by 10
Reliability in Electronic Packaging: Past, Now and Future
Zhiwen, C., Yunhui, M., Liu, S., Li, H., Liu, L., Lei, X., Ying, Z., & Xiang, G. (2021) · Journal of Mechanical Engineering · doi:10.3901/jme.2021.16.248 · Cited by 10
Yip, S. Y., Seng, H., Tan, C. P., & Chong, W. T. (2021) · International Journal of Electrical Power & Energy Systems · doi:10.1016/j.ijepes.2021.107875 · Cited by 10
Tawfiq, K. B., Zeineldin, H., Al‐Durra, A., & El-Sadaany, E. F. (2024) · Heliyon · doi:10.1016/j.heliyon.2024.e33008 · Cited by 10
Ding, J., Zhang, P., & Li, J. (2015) · IEEE International Conference on Power Electronics and Drive Systems (PEDS) · doi:10.1109/peds.2015.7203578 · Cited by 10
Nilsson, J., Borg, J., & Johansson, J. (2017) · Analog Integrated Circuits and Signal Processing · doi:10.1007/s10470-017-1011-6 · Cited by 10
Jlassi, I., & Cardoso, A. J. M. (2017) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2017.8216876 · Cited by 10
Improved Diagnosis Method for VSI Fed IM Drives Under Open IGBT Faults
Zdiri, M. A., Bouzidi, B., & Abdallah, H. H. (2018) · International Multi-Conference on Systems, Signals & Devices (SSD) · doi:10.1109/ssd.2018.8570425 · Cited by 10
A new approach for on-line open-circuit fault diagnosis of inverters based on current trajectory
Li, K., Chen, C.-Y., Chen, T., Cheng, S., Wu, X., & Xiang, C. (2019) · Journal of Central South University · doi:10.1007/s11771-019-4044-4 · Cited by 10
Hanif, A., Major, J. J., DeVoto, D. J., & Khan, F. (2019) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2019.8722046 · Cited by 10
ESR Estimation Schemes of Output Capacitor for Buck Converter from Capacitor Perspective
Ren, L., Zhang, L., & Gong, C. (2020) · Electronics · doi:10.3390/electronics9101596 · Cited by 10
Long, H., Ma, M., Guo, W., Li, F., & Zhang, X. (2020) · IEEE China International Youth Conference on Electrical Engineering (CIYCEE) · doi:10.1109/ciycee49808.2020.9332538 · Cited by 10
Digital Twin Based Condition Monitoring for High Power Converters
Gong, Y., Tian, Y., Wen, C., Luo, H., Li, C., & Li, W. (2022) · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · doi:10.1109/peac56338.2022.9959161 · Cited by 10
Leakage current compensation for a 450 nW, high-temperature, bandgap temperature sensor
Nilsson, J., Borg, J., & Johansson, J. (2015) · International Conference Mixed Design of Integrated Circuits and Systems · doi:10.1109/mixdes.2015.7208540 · Cited by 10
Inverter Device Nonlinearity Characterization Technique for Use in a Motor Drive System
Babel, A. S., Muetze, A., Seebacher, R. R., Krischan, K., & Strangas, E. G. (2014) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2014.2365636 · Cited by 10
Aguilera, R. P., Godoy, B. I., Agüero, J. C., Goodwin, G. C., & Yuz, J. I. (2014) · International Journal of Control · doi:10.1080/00207179.2013.876668 · Cited by 10
Application of a Heat Flux Sensor in Wind Power Electronics
Baygildina, E., Smirnova, L., Murashko, K., Juntunen, R., Mityakov, A. V., Kuisma, M., Pyrhönen, O., Peltoniemi, P., Hynynen, K. M., Mityakov, V. Y., et al. (2016) · Energies · doi:10.3390/en9060456 · Cited by 9
Jlassi, I., & Cardoso, A. J. M. (2017) · IEEE International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED) · doi:10.1109/demped.2017.8062381 · Cited by 10
Zaman, M. H. M., Mustafa, M. M., Hannan, M. A., & Hussain, A. (2018) · Bulletin of Electrical Engineering and Informatics · doi:10.11591/eei.v7i1.857 · Cited by 10
Joint Estimation of MOSFET Degradation in a DC-DC Converter Using Extended Kalman Filter
Alyakhni, A., Al-Mohamad, A., & Hoblos, G. (2019) · Conference on Control and Fault-Tolerant Systems · doi:10.1109/systol.2019.8864731 · Cited by 10
High Power Electronics: Key Technology for Wind Turbines
Blaabjerg, F., & Ma, K. (2014) · doi:10.1002/9781118755525.ch6 · Cited by 10
Imaging electromagnetic boundary of microdevice using a wide field quantum microscope
Wen, H., Liu, Y., Hao, W., Fu, Z., Gao, Z., Wang, D., Li, X., Li, Z., Guo, H., Ma, Z., et al. (2024) · Optics Express · doi:10.1364/oe.514770 · Cited by 9
Reddy, B. P., & Iqbal, A. (2021) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2021.3100984 · Cited by 9
An Estimation Method of High-Order LC Circuits in Power Electronic Converters
Yao, B., Peng, Y., Zhang, Y., Wang, H., & Wang, H. (2023) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2023.3285917 · Cited by 9
Evaluation of Bipolar Degradation in SiC MOSFETs for Converter Design
Wu, Y., Li, C., Ran, L., Cao, Q., Gammon, P. M., Feng, H., Li, Y., Ng, C., & Wu, B. (2023) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce53617.2023.10362409 · Cited by 9
Self-citationOnline Junction Temperature Estimation for IGBT Devices Through Knee Voltage
Wei, X., Yao, B., Zhang, Y., Peng, Y., & Wang, H. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3439250 · Cited by 9
Metadata
- Authors
- Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
- Affiliations
- University of Warwick (GB)
- Durham University (GB)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2010-11
- Volume
- 25
- Issue
- 11
- Pages
- 2734-2752
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2167320299
- Cited by
- 1,278
- References
- 135
- Citations by year
- 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
- FWCI
- 22.95
- Type
- journal article
- Language
- en
- Open access
- Licence
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- Durham Research Online (Durham University) (acceptedVersion)
- Durham Research Online (Durham University) (submittedVersion, cc-by)
- Funders
- Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review