Cited by 1,278Silicon Carbide Semiconductor TechnologiesReliability and Maintenance OptimizationMultilevel Inverters and Converters

The DOI matches its Crossref record; 125 of the 135 references it cites were found in a registry or an index.

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Open access

Yang, Shaoyong, Xiang, Dawei, Bryant, Angus, Mawby, Philip, Ran, Li, Tavner, Peter·2010·IEEE Transactions on Power Electronics

DOI 10.1109/tpel.2010.2049377

Open this paper in CoChat — free account

Abstract

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

Integrity signals

Registry

Crossref · 10.1109/tpel.2010.2049377

Cites

125 of 125 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Claims the paper makes

We couldn’t retrieve this paper’s full text, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Physics of Semiconductor Devices
Sze, S. M., & Ng, K. K. (2006) · doi:10.1002/0470068329 · Cited by 14,627
Physics of Semiconductor Devices
Colinge, J.-P., & Colinge, C. (2002) · Kluwer Academic Publishers eBooks · doi:10.1007/b117561 · Cited by 14,074
A Critical Analysis of Crack Propagation Laws
Paris, P. C., & Erdoğan, F. (1963) · Journal of Basic Engineering · doi:10.1115/1.3656900 · Cited by 7,168
Power electronics converters, applications and design
Robinson, F. V. P. (1997) · Microelectronics Journal · doi:10.1016/s0026-2692(97)87859-7 · Cited by 5,100
Power Electronics: Converters, Applications and Design
Mohan, N., Undeland, T. M., & Robbins, W. P. (1989) · Cited by 4,781
Fundamentals of Power Semiconductor Devices
Baliga, B. J. (2008) · Springer eBooks · doi:10.1007/978-0-387-47314-7 · Cited by 2,241
An Industry-Based Survey of Reliability in Power Electronic Converters
Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058
Self-citation
Selected failure mechanisms of modern power modules
Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039
Power Electronics: Converters, Applications, and Design
Mohan (2007) · Cited by 1,022
Power Electronics Handbook
(2002) · Elsevier eBooks · doi:10.1016/c2016-0-00847-1 · Cited by 940

Show all 135 references

Research works printed but not linked: 10

grant, 1989, Power MOSFET-Theory and Applications
scheuermann, 2002, power cycling lifetime of advanced power modules for different temperature swings, Proc Power Convers Intell Motion, 59
mermet-guyennet, 2008, Reliability requirement for traction power converters, ECPE Workshop Built-in Rel Power Electron Syst
wolfgang, 2007, Examples for failures in power electronics systems, ECPE Tutorial Rel Power Electron Syst
fratelli, 1999, reliability test of power igbt's for railway traction, Proc Eur Conf Power Electron Appl
ramminger, 2006, predicting the crack progression in pbsnag-solder under cyclic loading conditions, Int Conf Integr Power Syst
agyakwa, 2008, anomalous reliability behaviour of 99.99% and 99.999% pure aluminium wire bonds under thermal cycling, Proc IMAPS 41st Int Symp Microelectron
dunipace, 2008, test saturation voltage to achieve high efficiency, Power Electron Technol, 32
coquery, 1999, reliability improvement of the soldering thermal fatigue with alsic technology on traction high-power igbt modules, Proc Eur Conf Power Electron Appl
10.1109/63.704154 · DOI

Sorted by citations

Items 701–800 of 1,000

Online correction method of IGBT lifetime evaluation based on bonding wire failure monitoring
Qi, L., Du, L., Xiangyu, Z., Zhang, W., & Hong, S. (2022) · IET Power Electronics · doi:10.1049/pel2.12387 · Cited by 6
WBG Power Semiconductor Module Packaging Insulation Characteristics Under Electrothermal Stress
Liu, W., Jiang, J., Wang, Y., Zhang, J., Duan, X., Fu, R., & Zhang, C. (2024) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2024.3507821 · Cited by 6
An FCS-MPC-Based Threshold-Free Diagnosis Method for Open-Circuit Faults in Traction Inverters
Tao, H., Song, Y., Huang, Z., & Yu, Y. (2025) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2025.3526681 · Cited by 6
Fault Diagnosis and Tolerance in Converters of Brushless DC Motor Drives for Low-Speed Applications
Gupta, A., Bhakar, P. S., Ravula, S. R., & Jayaraman, K. (2025) · IEEE Transactions on Energy Conversion · doi:10.1109/tec.2025.3556012 · Cited by 6
Feasibility Analysis of Multiphase Machines for Electric Vehicle Applications
Tokgöz, F., Zhu, Z. Q., Chen, X., Liu, C., Yang, L., Yuan, Y., Yang, H. S., & Huang, Y. (2025) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2025.3582566 · Cited by 6
Online Health Monitoring of Multiple MOSFETs in a Grid-Tied PV Inverter using Spread Spectrum Time Domain Reflectometry (SSTDR)
Roy, S., & Khan, F. (2018) · International Power Electronics Conference (IPEC) · doi:10.23919/ipec.2018.8507778 · Cited by 6
Fault‐resilient control of parallel PV inverters using multi‐agent twin‐delayed deep deterministic policy gradient approach
Malik, A., Haque, A., Kurukuru, V. S. B., & Mekhilef, S. (2023) · International Journal of Circuit Theory and Applications · doi:10.1002/cta.3911 · Cited by 6
Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device
Shen, H., Zhang, J., Sun, P., & Ma, X. (2024) · IEEE International Electrical and Energy Conference (CIEEC) · doi:10.1109/cieec60922.2024.10583571 · Cited by 6
Portable Magnetic Camera Using NV Centers
Fu, Z., Wen, H. F., Hao, W., Liu, Y., Li, X., Li, Z., Guo, H., Ma, Z., Li, Y. J., Tang, J., et al. (2024) · IEEE Transactions on Instrumentation and Measurement · doi:10.1109/tim.2024.3451577 · Cited by 6
Thermal management implementation method for IGBT modules of inverters based on junction temperature estimation
Gong, Z., Zang, L., Wang, G., & Shen, Z. (2024) · Journal of Power Electronics · doi:10.1007/s43236-024-00911-4 · Cited by 6
A Fault-Tolerant Control Method for Improving Input Current Half-Wave Symmetry Under Single-Switch Open-Circuit Fault of Front-End Vienna Rectifier in More-Electric Aircraft
Yang, C., Zhang, F., Cheng, L., Zhang, Z., & Wang, T. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3467153 · Cited by 6
A Novel Method for Online Junction Temperature Monitoring of Power Module Based on In-Situ Sensor Fabrication
Ke, R., Hu, Z., Tao, J., Yang, Z., & Liu, C. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3485997 · Cited by 6
Short-Circuit Fault-Tolerant Topology and Control Strategy for Active Magnetic Bearing Drive Based on Shared Bridge Arm
Jiang, D., Hu, F., Shuai, Y., Liu, Z., & Wu, H. (2024) · IEEE/ASME Transactions on Mechatronics · doi:10.1109/tmech.2024.3479276 · Cited by 6
Mitigation of Leakage Current and Current Harmonics in PV Grid-Connected Systems Using a New H10 Three-Phase Inverter
Tawfiq, K. B., Zeineldin, H. H., Al‐Durra, A., & El-Saadany, E. F. (2024) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2024.3500071 · Cited by 6
An IGBT Device Health Status Assessment Method Based on Characteristics Identification
Duan, Z., Yao, R., Lai, W., Li, H., Yang, C., Min, Y., Yuan, Y., & Han, W. (2025) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2025.3532419 · Cited by 6
Dynamic heat transfer characteristics of R-410A refrigerant in saturated flow boiling under oscillating mass flux conditions
Chen, C. A., Hsu, S.-H., Lin, T. F., Li, W., & Yan, W. (2025) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2025.108681 · Cited by 6
Capacitance estimation algorithm based on DC-link voltage ripples using hybrid machine learning techniques in power electronics converters
AL-Wesabi, I., Al-Shamma’a, A. A., Farh, H. M. H., Dawood, R. A., Mwakipunda, G. C., & Xu, J. (2025) · Results in Engineering · doi:10.1016/j.rineng.2025.106216 · Cited by 6
A software frequency response analysis method to monitor degradation of power MOSFETs in basic single-switch converters
Düşmez, S., Bhardwaj, M., Sun, L., & Akin, B. (2016) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2016.7467919 · Cited by 6
Thermal Analysis of Modular Multilevel Converters Under Subsynchronous Oscillation
Liu, Y., Sheng, J., Dong, Y., Zheng, R., Li, W., He, X., Zhou, Z., & Xie, R. J. (2018) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2018.8558414 · Cited by 6
Investigation of the aging of power GaN HEMT under operational switching conditions, impact on the power converters efficiency
Bouchour, A. M., Oualkadi, A. E., Dherbécourt, P., Latry, O., & Echeverri, A. (2019) · Microelectronics Reliability · doi:10.1016/j.microrel.2019.113403 · Cited by 6
Fault detection technique for modified cascaded half-bridge multi-level inverter with polarity changer in pv grid system
Vyas, U. B., Shah, V. A., & Srivani, S. G. (2021) · SN Applied Sciences · doi:10.1007/s42452-021-04586-5 · Cited by 6
Modeling and optimization of OC fault diagnosis for inverters based on GR-PTA-BN
Sumin, H., He, Y., Huang, P., Shuqing, Z., Zhou, M., & Wang, F. (2021) · Microelectronics Reliability · doi:10.1016/j.microrel.2021.114457 · Cited by 6
Multiphase Electric Motor Drive with Improved and Reliable Performance: Combined Star-Pentagon Synchronous Reluctance Motor Fed from Matrix Converter
Tawfiq, K. B., Ibrahim, M. N. F., & Sergeant, P. (2022) · Mathematics · doi:10.3390/math10183351 · Cited by 6
A health state prediction method of traction converter IGBT based on optimized particle filter
Shi, Y., Ai, Y., Chen, S., Zhang, C., & Liu, J. (2022) · Microelectronics Reliability · doi:10.1016/j.microrel.2022.114840 · Cited by 6
Reliability Prediction of Bridgeless AC-DC SEPIC with V-Fill for LED Applications
Lakshmipraba., B., & Seyezhai, R. (2022) · International Conference on Power, Energy, Control and Transmission Systems (ICPECTS) · doi:10.1109/icpects56089.2022.10047352 · Cited by 6
Condition Monitoring of Submodule Capacitors in Modular Multilevel Converter Using Digital Twin
Painuly, M., Rajendran, S., & Jena, D. (2023) · International Conference on Power, Instrumentation, Control and Computing (PICC) · doi:10.1109/picc57976.2023.10142579 · Cited by 6
Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors
Chen, S., Vilchis-Rodriguez, D. S., Barnes, M., & Djurović, S. (2023) · IEEE Sensors Journal · doi:10.1109/jsen.2023.3301070 · Cited by 6
DC-link Capacitance Estimation based on Discharge Profile of Inverter for EV Application
Wei, X., Peng, Y., Yao, B., & Wang, H. (2023) · International Conference on Power Electronics and ECCE Asia (ICPE-ECCE Asia) · doi:10.23919/icpe2023-ecceasia54778.2023.10213625 · Cited by 6
Power and Thermal Cycling Testbed for End of Life Assessment of Semiconductor Devices
Molenaar, M., Kardan, F., Shekhar, A., & Bauer, P. (2023) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon51785.2023.10312731 · Cited by 6
End-of-Life Comparison of Full-Bridge and Half-Bridge DC/DC Converter Switches Used for EV Charging
Kardan, F., Shekhar, A., & Bauer, P. (2023) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon51785.2023.10312649 · Cited by 6
Battery-electric powertrain system design for the HorizonUAM multirotor air taxi concept
Jäger, F., Bertram, O., Lübbe, S. M., Bismark, A. H., Rosenberg, J., & Bartscht, L. (2024) · CEAS Aeronautical Journal · doi:10.1007/s13272-024-00759-1 · Cited by 6
A method for health monitoring of power MOSFETs based on threshold voltage
Ren, L., Gong, C., Shen, Q., & Wang, H. (2015) · IEEE Conference on Industrial Electronics and Applications (ICIEA) · doi:10.1109/iciea.2015.7334390 · Cited by 6
Single chip wireless condition monitoring of power semiconductor modules
Nilsson, J., Borg, J., & Johansson, J. (2015) · IEEE Nordic Circuits and Systems Conference (NorCAS) · doi:10.1109/norchip.2015.7364407 · Cited by 6
Power switch lifetime extension strategies for three-phase converters
Düşmez, S., Uğur, E., & Akin, B. (2016) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2016.7468018 · Cited by 6
Z-source resonant converter with power factor correction for wireless power transfer applications
Gonzalez-Santini, N. S., Zeng, H., Yu, Y., & Peng, F. Z. (2016) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2016.7855564 · Cited by 6
Open switch fault diagnosis methods for an AC/DC line-side converter
Sobański, P., & Orłowska-Kowalska, T. (2017) · IEEE International Conference on Industrial Technology (ICIT) · doi:10.1109/icit.2017.7915604 · Cited by 6
Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application
Hu, B., Zeng, Z., Shao, W., Ma, Q., Ren, H. J., Li, H., Ran, L., & Li, Z. (2017) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2017.7931133 · Cited by 6
Self-citation
Online collector-emitter saturation voltage measurement for the in-situ temperature estimation of a high-power 4.5 kV IGBT module
Hoeer, M., Weiss, F., & Bernet, S. (2017) · European Conference on Power Electronics and Applications · doi:10.23919/epe17ecceeurope.2017.8099155 · Cited by 6
Online Condition Monitoring of IGBT Modules Using Gate-Charge Identification
Sathik, M. H. M., Sundararajan, P., Sasongko, F., Pou, J., & Gupta, A. K. (2019) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2019.8722200 · Cited by 6
Nanoseconds Switching Time Monitoring of Insulated Gate Bipolar Transistor Module by Under-Sampling Reconstruction of High-Speed Switching Transitions Signal
Li, H., Zhao, M., Yan, H., & Yang, X. (2019) · Electronics · doi:10.3390/electronics8101203 · Cited by 6
Security Analysis of Power Electronic-based Power Systems
Shakerighadi, B., Peyghami, S., Ebrahimzadeh, E., Blaabjerg, F., & Bak, C. L. (2019) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2019.8927536 · Cited by 6
Dynamic Safe Operating Area (SOA) of Power Semiconductor Devices
Roy, S., & Khan, F. (2020) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec39645.2020.9124189 · Cited by 6
Parameter identification based on linear model for buck converters
Ren, L., & Gong, C. (2020) · Electrical Engineering · doi:10.1007/s00202-020-01080-w · Cited by 6
A reliable and efficient modified T‐type fault tolerant five level inverter configuration
Saketi, S. K., Chaturvedi, P., Yadeo, D., & Atkar, D. D. (2021) · International Transactions on Electrical Energy Systems · doi:10.1002/2050-7038.12975 · Cited by 6
Modeling and Analysis of Multiple Open-Switch Faults in Converters Supplying Permanent-Magnet Synchronous Machines
Pecha, U., Parspour, N., & Gieck, F. (2021) · IEEE International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED) · doi:10.1109/sdemped51010.2021.9605533 · Cited by 6
Reliability Analysis of Power Electronic Topology Based on Bayesian Network
Hu, W., Li, M., Si, T., Zhu, X., & Zhao, L. (2021) · Global Reliability and Prognostics and Health Management Conference (PHM) · doi:10.1109/phm-nanjing52125.2021.9612940 · Cited by 6
Neural Network based Open-circuit Fault Diagnosis for Three-Level Neutral-Point-Clamped Back-to-Back Converters
Zhang, X., Li, Z., Zhang, Z., Zhang, M., Chen, H., & Zhang, Z. (2021) · IEEE International Conference on Predictive Control of Electrical Drives and Power Electronics (PRECEDE) · doi:10.1109/precede51386.2021.9680955 · Cited by 6
Converter State-Space Model Estimation Using Dynamic Mode Decomposition
Suskis, P., Zaķis, J., Suzdalenko, A., Khang, H. V., Rassõlkin, A., Vaimann, T., & Pomarnacki, R. (2022) · IEEE International Energy Conference (ENERGYCON) · doi:10.1109/energycon53164.2022.9830201 · Cited by 6
A Space Vector Based Diagnosis Method for Switch Open-Circuit Fault in Vienna Rectifier
Liu, M., Li, P., Xu, W., Guo, X., & Chen, C. (2022) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce50734.2022.9947915 · Cited by 6
Methods and challenges for the fault detection and diagnosis in power electronic converters: An overview
Rosas, R. A. P., Mejía, É. F., & Orozco-Gutiérrez, M. L. (2022) · IEEE ANDESCON · doi:10.1109/andescon56260.2022.9989627 · Cited by 6
Open circuit fault diagnosis and fault classification in multi-level inverter using fuzzy inference system
Singh, V., Yadav, A., & Gupta, S. (2023) · Serbian Journal of Electrical Engineering · doi:10.2298/sjee2302163s · Cited by 6
Load Profile Based Reliability Assessment of IGBT Module in Full-bridge DC/DC Converter for Fast Charging of EVs
Kardan, F., Ahmadi, M., Shekhar, A., & Bauer, P. (2023) · European Conference on Power Electronics and Applications · doi:10.23919/epe23ecceeurope58414.2023.10264317 · Cited by 6
A generic framework for wind power forecasting
Amiri, R., & Wang, B. (2011) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2011.6119412 · Cited by 6
A fault tolerant topology of inverter for micro-grid
Li, Y., Li, B., Shuai, Z., & Shen, Z. J. (2016) · IEEE International Conference on Industrial Technology (ICIT) · doi:10.1109/icit.2016.7474787 · Cited by 6
Adding inverter fault detection to model-based predictive control for flying-capacitor inverters
Druant, J., Vyncke, T. J., & Melkebeek, J. A. A. (2013) · IEEE International Symposium on Sensorless Control for Electrical Drives (SLED) · doi:10.1109/sled-precede.2013.6684498 · Cited by 6
Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules
Lee, C., Kao, K., & Huang, Y. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3414829 · Cited by 6
Novel On-State Voltage Measurement Circuit Topology, Operation, and Performance for High-Voltage Wide-Bandgap Devices
Gill, L., Rodriguez, L. A. G., Kaplar, R., & Michaels, A. J. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3583677 · Cited by 5
A Survey of AI in System of Systems With a Focus on Power Electronic Systems—Part II: Maintenance and Forecasting
Tehrani, K., Khan, N. M., Djaghloul, C., Abbas, T., Bonnet, P., Paladian, F., Pasquier, C., Drissi, K. E. K., Vurpillot, F., & Jamshidi, M. M. (2025) · IEEE Systems Journal · doi:10.1109/jsyst.2025.3641439 · Cited by 5
Comparative analysis of different machine learning techniques for condition monitoring of capacitors in a SEPIC converter
Rajendran, S., Jena, D., Díaz, M., & Devi, V. S. K. (2022) · IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT) · doi:10.1109/globconpt57482.2022.9938150 · Cited by 5
Research on Online Monitoring Method for Bond Wire Fatigue Applied to IGBT Module
Liu, H., Wang, F. “., Xia, W., & Shen, C. (2023) · Electronics · doi:10.3390/electronics12163432 · Cited by 5
Information Fusion Model Based Improved Multi-Scale Convolutional Neural Network for Fault Diagnosis in EV V2G Charging Pile
Zou, Z., Zeng, Z., Wen, Y., Wang, W., Xu, Y., & Tao, J. (2023) · IEEE Conference on Energy Internet and Energy System Integration (EI2) · doi:10.1109/ei259745.2023.10513295 · Cited by 5
A Data-Driven Lifetime Prediction Method for Thermally Aged SiC MOSFET Applications
Kang, W., Tan, S., Vásquez, J. C., Guerrero, J. M., Hertle, T., Gietzold, T., Benn, A., & Wei, B. (2024) · Prognostics and System Health Management Conference · doi:10.1109/phm61473.2024.00058 · Cited by 5
LC Parameters Identification for a Three-Phase AC–DC Converter Through Digital Twin Modeling Technique and Optimization Algorithms
Nezio, G. D., Diz, S. D. L., Benedetto, M. D., Lidozzi, A., Bueno, E. J., & Solero, L. (2025) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2025.3534616 · Cited by 5
Thermal degradation management in a Fault-tolerant active NPC converter
Ferreira, V. N., Rocha, A. V., & Filho, B. J. C. (2015) · IEEE Brazilian Power Electronics Conference and Southern Power Electronics Conference · doi:10.1109/cobep.2015.7420111 · Cited by 5
Analysis and Modeling for the Real-Time Condition Evaluating of MOSFET Power Device Using Adaptive Neuro-Fuzzy Inference System
Xu, S., Yang, X., Chen, M., Lai, W., Wang, Y., & Ran, L. (2019) · IEEE Access · doi:10.1109/access.2018.2890022 · Cited by 5
Self-citation
Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling
Yuan, C. C. A., Hong, Y.-J., Lee, C.-C., Chiang, K., & Huang, J.-H. (2019) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/eurosime.2019.8724570 · Cited by 5
Internal Voltage Phase-Amplitude Dynamic Analysis With Interface Friendly Back-To-Back Power Converter Average Model for Less Power Electronics-Based More-Electric Ship
Ni, K., Hu, Y., Liang, R., Wen, H., & Alkahtani, M. S. (2019) · IEEE Access · doi:10.1109/access.2019.2927617 · Cited by 5
Artificial Neural Network Based Open-Transistor Fault Detection in Symmetric Cascaded H-Bridge Multilevel Inverter
Sharma, V. K., Rinsha, V., & Jagadanand, G. (2021) · International Conference for Emerging Technology (INCET) · doi:10.1109/incet51464.2021.9456182 · Cited by 5
Analysis of the IGBT Module with Bonding Wire Failure Based on Transient Thermal Impedance
Gao, J., Lv, Z., Lu, Y., Song, P., Zhao, Y., Xu, G., & Yang, M. (2022) · Journal of Physics Conference Series · doi:10.1088/1742-6596/2276/1/012033 · Cited by 5
Lifetime Extension Technique for Voltage Source Inverters Using Selected Switching States-Based MPC Method
Nguyen, M. H., Kwak, S., & Choi, S. (2023) · IEEE Access · doi:10.1109/access.2023.3302924 · Cited by 5
Some Security Aspects of Batteries and Power Electronic Converters in a Microgrid
Matić, L., Draženović, K., Šunde, V., & Ban, Ž. (2023) · IEEE Access · doi:10.1109/access.2023.3327164 · Cited by 5
An Improved Fault-Tolerant Method Based on Floating Capacitor Voltage Balance for Hybrid T2C-HB Converter
Zhou, G., Xing, X., Du, C., Zhang, S., Zhang, R., & Chen, Z. (2024) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2024.3390747 · Cited by 5
On-Chip Concurrent Device Aging Prognosis and Dielectric Failure Detection for GaN Power Devices
Du, L., Huang, Y., & Ma, D. B. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3413730 · Cited by 5
Robustness Analysis of 1200-V IGBT Under Extremely High-Gate Voltage Stress
Liao, P., Xu, H., Guo, J., Chen, X.-R., Wang, C., Sun, Q., & Zhang, D. W. (2025) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2025.3545403 · Cited by 5
Stress Management of Wind Turbine Components Using a Nano-Enhanced Phase Change Material Integrated Power Module
Zhang, X., Wan, H., Iosifidis, N., Hu, B., Wei, J., Cao, Q., Zhong, Y., Wu, Y., Wu, K., Li, J., et al. (2025) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2025.3583824 · Cited by 5
Self-citation
System identification and adaptive control of a DC-DC converter using a current balancing ON/OFF control technique for optimal transient performance
Wang, C., Armstrong, M., & Gadoue, S. M. (2015) · European Conference on Power Electronics and Applications · doi:10.1109/epe.2015.7309464 · Cited by 5
Small junction temperature cycles on die-attach solder layer in IGBT
Lai, W., Chen, M., Ran, L., Xu, S., Gao, B., & Jiang, N. (2015) · European Conference on Power Electronics and Applications · doi:10.1109/epe.2015.7309301 · Cited by 5
Self-citation
Control and optimisation of power consumption in Radio Base stations
Fabbri, G., Cardoso, A. J. M., Boccaletti, C., & Girimonte, A. (2011) · International Telecommunications Energy Conference (INTELEC) · doi:10.1109/intlec.2011.6099752 · Cited by 5
A fault-tolerant PMSG drive for wind turbine applications with minimal increase of the hardware requirements
Freire, N. M. A., & Cardoso, A. J. M. (2013) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2013.6520700 · Cited by 5
Evaluation of a diagnostic information on common electrical faults contained in signals of an inverter-fed AC IM drive with current-oriented control
Radecki, A., Dębowski, A., Wojcik, M., & Lipnicki, P. (2016) · IEEE International Conference on Compatibility, Power Electronics and Power Engineering · doi:10.1109/cpe.2016.7544201 · Cited by 5
Fault Tolerance Enhance DC-DC Converter Lifetime Extension
Alghassi, A., Soulatiantork, P., Samie, M., Uriondo, A., Perinpanayagam, S., & Faifer, M. (2017) · Procedia CIRP · doi:10.1016/j.procir.2017.02.014 · Cited by 5
Sensitivity analysis of switching electrical parameters of semiconductor devices for wind turbine converters
Moeini, R., Tricoli, P., Hemida, H., & Baniotopoulos, C. C. (2017) · International Conference on Clean Electrical Power · doi:10.1109/iccep.2017.8004745 · Cited by 5
Prognosis of enhance mode gallium nitride high electron mobility transistors using on-state resistance as fault precursor
Haque, M. S., & Choi, S. (2017) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2017.8096400 · Cited by 5
Online junction temperature for off-the-shelf power converters
Sathik, M. H. M., Sundararajan, P., Sasongko, F., Padmanabhan, S. K., Pou, J., & Simanjorang, R. (2018) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2018.8341409 · Cited by 5
Failure Mechanism Analysis and Physics-of-Failure Lifetime Prediction Method for Press-Pack Thyristor of Converter Valve
Liang, N., Zhang, Z., Gou, Y., Liu, C., Yang, Z., Chen, J., Zhuo, F., & Wang, F. (2018) · International Power Electronics Conference (IPEC) · doi:10.23919/ipec.2018.8507978 · Cited by 5
Investigation of Reliability Aspects of Photovoltaic Quasi Z-Source Inverter
Umarani, D., & Seyezhai, R. (2018) · IEEE International Conference on Power Electronics, Drives and Energy Systems · doi:10.1109/pedes.2018.8707693 · Cited by 5
A Review of Power Electronic Parametric Fault Diagnosis Methods
Wan, Z., Lin, Q., Qiao, F., Zhang, Z., Zong, Y., & Su, X. (2019) · International Conference on Intelligent Green Building and Smart Grid · doi:10.1109/igbsg.2019.8886330 · Cited by 5
Fault-Tolerant Design of Three-phase Dual-Buck VSI Topologies
Cordeiro, A., Pires, V. F., & Silva, J. F. (2019) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2019.8927183 · Cited by 5
An Advanced Wideband Model and a Novel Multitype Insulation Monitoring Strategy for VSC-Connected Transformers Based on Common-Mode Impedance Response
Lu, G., Zheng, D., & Zhang, P. (2021) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2021.3051597 · Cited by 5
Temperature Estimation of SiC Power Devices Using High Frequency Chirp Signals
Lu, X., Pickert, V., Al‐Greer, M., Chen, C., Wang, X., & Tsimenidis, C. C. (2021) · Energies · doi:10.3390/en14164912 · Cited by 5
Spark-Plasma Sintering and Related Field- Assisted Powder Consolidation Technologies
Olevsky, E. A. (2017) · MDPI eBooks · doi:10.3390/books978-3-03842-383-6 · Cited by 5
A General Diode Open-Circuit Fault Diagnosis Method for Autotransformer Rectifier Unit Considering Grid Voltage Disturbance
Yang, C., Zhang, F., Cheng, L., & Zhang, Z. (2022) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2022.3220370 · Cited by 5
A Lifetime Prediction Method for IGBT Modules Considering the Effects of Multi-Factors
Chen, K. (2023) · CPSS Transactions on Power Electronics and Applications · doi:10.24295/cpsstpea.2023.00029 · Cited by 5
Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs
Baker, N., Dupont, L., Bęczkowski, S., & Iannuzzo, F. (2024) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2024.3370951 · Cited by 5
Modular application relevant stress testing for next generation power semiconductors
Sievers, M., Glavanovics, M., Rhinow, C., & Findenig, B. (2019) · Microelectronics Reliability · doi:10.1016/j.microrel.2019.06.022 · Cited by 5
Hybrid Condition Monitoring for Power Electronic Systems
Marković, N., Stoetzel, T., Staudt, V., & Kolossa, D. (2019) · International Conference on Machine Learning and Applications · doi:10.1109/icmla.2019.00275 · Cited by 5
An Anti-Interference Online Monitoring Method for IGBT Bond Wire Aging
Wang, C., He, Y., Jiang, Y., & Li, L. (2021) · Electronics · doi:10.3390/electronics10121449 · Cited by 5
Inverter open-circuit fault diagnosis method in PMSG based wind energy conversion system
Mahdhi, H. B., Azza, H. B., & Jemli, M. (2021) · Electrical Engineering · doi:10.1007/s00202-021-01354-x · Cited by 5
Prognosis of chip-loss failure in high-power IGBT module by self-testing
Liu, Y., Xiang, D., & Fu, Y. (2016) · Annual Conference of the IEEE Industrial Electronics Society (IECON) · doi:10.1109/iecon.2016.7793051 · Cited by 5
Self-citation
Mechanism Analysis of Bond Wire Degradation Leading to the Increase of IGBT Collector-Emitter Voltage
Jia, Y., Duan, Y., Xiao, F., Luo, Y., Liu, B., & Deng, H. (2018) · IEEE International Power Electronics and Application Conference and Exposition (PEAC) · doi:10.1109/peac.2018.8590628 · Cited by 5

Authors: Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
Affiliations: University of Warwick (GB)
Durham University (GB)
ORCID: Xiang, Dawei
Mawby, Philip
Ran, Li
Venue: IEEE Transactions on Power Electronics
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Published: 2010-11
Volume: 25
Issue: 11
Pages: 2734-2752
ISSN: 0885-8993 (ISSN-L)
1941-0107
DOI: 10.1109/tpel.2010.2049377
OpenAlex: W2167320299
Cited by: 1,278
References: 135
Citations by year: 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
FWCI: 22.95
Type: journal article
Language: en
Open access: green
durham-repository.worktribe.com
Licence: cc-by
ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
doi.org/10.15223/policy-029 (stm-asf)
doi.org/10.15223/policy-037 (stm-asf)
Locations: IEEE Transactions on Power Electronics (publishedVersion)
Durham Research Online (Durham University) (acceptedVersion)
Durham Research Online (Durham University) (submittedVersion, cc-by)
Funders: Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
Topics: Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
Keywords: condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Abstract

Overview

Integrity signals

Verification

Claims the paper makes

Claims other papers make about this one

Citations

Cites

Cited by

Related

Metadata

Record

About these checks