Cited by 1,278Silicon Carbide Semiconductor TechnologiesReliability and Maintenance OptimizationMultilevel Inverters and Converters

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Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

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Yang, Shaoyong, Xiang, Dawei, Bryant, Angus, Mawby, Philip, Ran, Li, Tavner, Peter·2010·IEEE Transactions on Power Electronics

DOI 10.1109/tpel.2010.2049377

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Abstract

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

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Authors: Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
Affiliations: University of Warwick (GB)
Durham University (GB)
ORCID: Xiang, Dawei
Mawby, Philip
Ran, Li
Venue: IEEE Transactions on Power Electronics
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Published: 2010-11
Volume: 25
Issue: 11
Pages: 2734-2752
ISSN: 0885-8993 (ISSN-L)
1941-0107
DOI: 10.1109/tpel.2010.2049377
OpenAlex: W2167320299
Cited by: 1,278
References: 135
Citations by year: 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
FWCI: 22.95
Type: journal article
Language: en
Open access: green
durham-repository.worktribe.com
Licence: cc-by
ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
doi.org/10.15223/policy-029 (stm-asf)
doi.org/10.15223/policy-037 (stm-asf)
Locations: IEEE Transactions on Power Electronics (publishedVersion)
Durham Research Online (Durham University) (acceptedVersion)
Durham Research Online (Durham University) (submittedVersion, cc-by)
Funders: Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
Topics: Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
Keywords: condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability

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Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

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