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Condition Monitoring for Device Reliability in Power Electronic Converters: A Review
Open accessAbstract
Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.
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“According to [238], [239], power semiconductor device damages account for approximately 35% of all ASD faults.”
From Fault Diagnosis and Fault-Tolerant Control of PMSM Drives–State of the Art and Future Challenges (2022) · cites this paper as [238]
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Study on the effects of small swing of junction temperature cycles on solder layer in an IGBT module
Chen, Y., Chen, M., Lai, W., Ran, L., Xu, S., Jiang, N., Alatise, O. M., & Mawby, P. (2016) · International Power Electronics and Motion Control Conference (EPE-PEMC) · doi:10.1109/ipemc.2016.7512813 · Cited by 3
Self-citationAshourloo, M., Namburi, V. R., Piqué, G. V., Pigott, J., Bergveld, H. J., Sherif, A. E., & Trescases, O. (2019) · European Conference on Power Electronics and Applications · doi:10.23919/epe.2019.8915557 · Cited by 3
Capacitors Energy Strategy Based Cascaded H-Bridge Converter for DC Port Failures
Xu, P., Liu, X., Guolong, Y., Liu, X., Gao, L., & Zhu, X. (2019) · Journal of Power Electronics · doi:10.6113/jpe.2019.19.5.1133 · Cited by 3
Wang, Y., Niu, Z., Yang, M., Sun, L., & Zhang, W. (2021) · IET Power Electronics · doi:10.1049/pel2.12043 · Cited by 3
Chiodo, E., & Mazzanti, G. (2021) · Electronics · doi:10.3390/electronics10202553 · Cited by 3
Al-Mohamad, A., Puig, V., & Hoblos, G. (2021) · European Control Conference (ECC) · doi:10.23919/ecc54610.2021.9655047 · Cited by 3
Inverter device nonlinearity characterization technique for use in a motor drive system
Babel, A. S., Muetze, A., Seebacher, R. R., Krischan, K., & Strangas, E. G. (2014) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2014.6803696 · Cited by 3
Metadata
- Authors
- Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P.
- Affiliations
- University of Warwick (GB)
- Durham University (GB)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2010-11
- Volume
- 25
- Issue
- 11
- Pages
- 2734-2752
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2167320299
- Cited by
- 1,278
- References
- 135
- Citations by year
- 2026: 65 · 2025: 104 · 2024: 105 · 2023: 137 · 2022: 93 · 2021: 104 · 2020: 93 · 2019: 109 · 2018: 94 · 2017: 79 · 2016: 80 · 2015: 63 · 2014: 60 · 2013: 49 · 2012: 22
- FWCI
- 22.95
- Type
- journal article
- Language
- en
- Open access
- Licence
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- Durham Research Online (Durham University) (acceptedVersion)
- Durham Research Online (Durham University) (submittedVersion, cc-by)
- Funders
- Engineering and Physical Sciences Research Council (EP/E02744X/1, EP/E026923/1)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Safety, Risk, Reliability and Quality › Reliability and Maintenance Optimization
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- condition monitoring, power semiconductor devices, power converters, device reliability, failure mechanisms, reliability modeling, sensor technology, signal processing, power electronics reliability
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