Simultaneous measurement of thermal conductivity and heat capacity of bulk and thin film materials using frequency-dependent transient thermoreflectance method
Abstract
The increasing interest in the extraordinary thermal properties of nanostructures has led to the development of various measurement techniques. Transient thermoreflectance method has emerged as a reliable measurement technique for thermal conductivity of thin films. In this method, the determination of thermal conductivity usually relies much on the accuracy of heat capacity input. For new nanoscale materials with unknown or less-understood thermal properties, it is either questionable to assume bulk heat capacity for nanostructures or difficult to obtain the bulk form of those materials for a conventional heat capacity measurement. In this paper, we describe a technique for simultaneous measurement of thermal conductivity κ and volumetric heat capacity C of both bulk and thin film materials using frequency-dependent time-domain thermoreflectance (TDTR) signals. The heat transfer model is analyzed first to find how different combinations of κ and C determine the frequency-dependent TDTR signals. Simultaneous measurement of thermal conductivity and volumetric heat capacity is then demonstrated with bulk Si and thin film SiO2 samples using frequency-dependent TDTR measurement. This method is further testified by measuring both thermal conductivity and volumetric heat capacity of novel hybrid organic-inorganic thin films fabricated using the atomic/molecular layer deposition. Simultaneous measurement of thermal conductivity and heat capacity can significantly shorten the development/discovery cycle of novel materials.
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TDTR has been frequently used to measure the heat capacity of new materials and the thermal conductance of various solid/solid interfaces.
“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [38]
At a low modulation frequency of 0.1 MHz, the sensitivities to K and C have similar amplitudes but opposite signs, so the TDTR signal is mainly affected by the thermal diffusivity of the substrate.
“As the modulation frequency decreases to sufficiently low of 0.1 MHz, the sensitivities to K and C have the similar amplitudes but opposite signs, suggesting that the TDTR signal is mainly affected by the thermal diffusivity ߙ ൌ ܥ ܭ / of the substrate at low modulation frequencies.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [38]
TDTR can determine thermal conductivity K and heat capacity C simultaneously for both bulk and thin film materials by performing multiple measurements at different modulation frequencies.
“TDTR has been demonstrated to determine thermal conductivity K and heat capacity C simultaneously for both bulk and thin film materials by performing multiple measurements using different modulation frequencies, 38, 39”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [38]
Frequency-dependent TDTR determined the heat capacity of bulk Si with ±5% agreement with the literature value.
“A good agreement of ±5% in the determined C of bulk Si was achieved with the literature value.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [38]
At a high modulation frequency of 10 MHz, the TDTR signal has the same sensitivity to K and C, so the signal is mostly determined by the thermal effusivity of the substrate.
“At a high modulation frequency of 10 MHz, the TDTR signal has the same sensitivity to K and C , suggesting that the TDTR signal V in / V out is mostly determined by the thermal effusivity ݁ ൌ √ ܥܭ of the substrate at high modulation frequencies.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [38]
Cites
Carslaw, H. S., & Jaeger, J. C. (1947) · International Linear Collider · Cited by 19,877 · see citing works
Atomic Layer Deposition: An Overview
George, S. M. (2009) · Chemical Reviews · doi:10.1021/cr900056b · Cited by 5,841 · see citing works
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R. D., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 3,225 · see citing works
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543 · see citing works
Effects of chemical bonding on heat transport across interfaces
Losego, M. D., Grady, M. E., Sottos, N. R., Cahill, D. G., & Braun, P. V. (2012) · Nature Materials · doi:10.1038/nmat3303 · Cited by 701 · see citing works
Surface Chemistry for Atomic Layer Growth
George, S. M., Ott, A. W., & Klaus, J. W. (1996) · The Journal of Physical Chemistry · doi:10.1021/jp9536763 · Cited by 680 · see citing works
Schmidt, A. J., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.3006335 · Cited by 655 · see citing works
Self-citationThermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611 · see citing works
(2006) · Choice Reviews Online · doi:10.5860/choice.43-2818 · Cited by 591 · see citing works
Thermal Conductivity Spectroscopy Technique to Measure Phonon Mean Free Paths
Minnich, A. J., Johnson, J. A., Schmidt, A. J., Esfarjani, K., Dresselhaus, M. S., Nelson, K. A., & Chen, G. (2011) · Physical Review Letters · doi:10.1103/physrevlett.107.095901 · Cited by 556 · see citing works
Self-citationA frequency-domain thermoreflectance method for the characterization of thermal properties
Schmidt, A. J., Cheaito, R., & Chiesa, M. (2009) · Review of Scientific Instruments · doi:10.1063/1.3212673 · Cited by 543 · see citing works
Self-citationThermal conductivity of <i>a</i> -Si:H thin films
Cahill, D. G., Katiyar, M., & Abelson, J. R. (1994) · Physical Review B · doi:10.1103/physrevb.50.6077 · Cited by 523 · see citing works
Thermal conductance of metal-metal interfaces
Gundrum, B. C., Cahill, D. G., & Averback, R. S. (2005) · Physical Review B · doi:10.1103/physrevb.72.245426 · Cited by 417 · see citing works
Surface Chemistry for Molecular Layer Deposition of Organic and Hybrid Organic−Inorganic Polymers
George, S. M., Yoon, B., & Dameron, A. A. (2009) · Accounts of Chemical Research · doi:10.1021/ar800105q · Cited by 379 · see citing works
Tien, C. L., Majumdar, A., & Gerner, F. M. (1998) · Taylor & Francis eBooks · Cited by 334 · see citing works
Stevens, R. J., Smith, A. N., & Norris, P. M. (2005) · Journal of Heat Transfer · doi:10.1115/1.1857944 · Cited by 293 · see citing works
Zhu, J., Tang, D., Wang, W., Liu, J., Holub, K. W., & Yang, R. (2010) · Journal of Applied Physics · doi:10.1063/1.3504213 · Cited by 232 · see citing works
Self-citationHopkins, P. E., Serrano, J. R., Phinney, L. M., Kearney, S. P., Grasser, T. W., & Harris, C. T. (2010) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4000993 · Cited by 192 · see citing works
“Zincone” Zinc Oxide−Organic Hybrid Polymer Thin Films Formed by Molecular Layer Deposition
Peng, Q., Gong, B., VanGundy, R. M., & Parsons, G. N. (2009) · Chemistry of Materials · doi:10.1021/cm8020403 · Cited by 190 · see citing works
An optical pump-probe technique for measuring the thermal conductivity of liquids
Schmidt, A., Chiesa, M., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.2937458 · Cited by 184 · see citing works
Self-citationOptical Measurement of Thermal Conductivity Using Fiber Aligned Frequency Domain Thermoreflectance
Malen, J. A., Baheti, K., Tong, T., Zhao, Y., Hudgings, J. A., & Majumdar, A. (2011) · Journal of Heat Transfer · doi:10.1115/1.4003545 · Cited by 145 · see citing works
Thermal conductivity of isotopically pure and Ge-doped Si epitaxial layers from 300 to 550 K
Cahill, D. G., & Watanabe, F. (2004) · Physical Review B · doi:10.1103/physrevb.70.235322 · Cited by 93 · see citing works
George, S. M., Lee, B. H., Yoon, B., Abdulagatov, A. I., & Hall, R. A. (2011) · Journal of Nanoscience and Nanotechnology · doi:10.1166/jnn.2011.5034 · Cited by 80 · see citing works
Lai, S. L., Ramanath, G., Allen, L. H., & Infante, P. (1997) · Applied Physics Letters · doi:10.1063/1.119299 · Cited by 76 · see citing works
Influence of anisotropy on thermal boundary conductance at solid interfaces
Hopkins, P. E., Beechem, T. E., Duda, J. C., Hattar, K., Ihlefeld, J. F., Rodriguez, M. A., & Piekos, E. S. (2011) · Physical Review B · doi:10.1103/physrevb.84.125408 · Cited by 74 · see citing works
Hernández‐Sánchez, F. (2007) · Journal of Applied Polymer Science · doi:10.1002/app.26418 · Cited by 9 · see citing works
Flagged first, then by citations
Cited by
Sorted by citations
High thermal conductivity in cubic boron arsenide crystals
Li, S., Zheng, Q., Lv, Y., Liu, X., Wang, X., Huang, P. Y., Cahill, D. G., & Lv, B. (2018) · Science · doi:10.1126/science.aat8982 · Cited by 600 · see citing works
Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 526 · see citing works
Self-citationCharge‐Induced Disorder Controls the Thermal Conductivity of Entropy‐Stabilized Oxides
Braun, J. L., Rost, C. M., Lim, M., Giri, A., OLSON, D. H. L., Kotsonis, G. N., Stan, G., Brenner, D. W., Maria, J., & Hopkins, P. E. (2018) · Advanced Materials · doi:10.1002/adma.201805004 · Cited by 512 · see citing works
Jiang, P., Qian, X., & Yang, R. (2018) · Journal of Applied Physics · doi:10.1063/1.5046944 · Cited by 424 · see citing works
Self-citationExtremely anisotropic van der Waals thermal conductors
Kim, S. E., Mujid, F., Rai, A., Eriksson, F., Suh, J., Poddar, P. K., Ray, A., Park, C., Fransson, E., Zhong, Y., et al. (2021) · Nature · doi:10.1038/s41586-021-03867-8 · Cited by 340 · see citing works
Thermal Conductivity and Elastic Constants of PEDOT:PSS with High Electrical Conductivity
Líu, J., Wang, X., Li, D., Coates, N. E., Segalman, R. A., & Cahill, D. G. (2015) · Macromolecules · doi:10.1021/ma502099t · Cited by 308 · see citing works
Liu, J., Choi, G.-M., & Cahill, D. G. (2014) · Journal of Applied Physics · doi:10.1063/1.4904513 · Cited by 262 · see citing works
Jiang, P., Qian, X., Gu, X., & Yang, R. (2017) · Advanced Materials · doi:10.1002/adma.201701068 · Cited by 239 · see citing works
Self-citationTuning thermal conductivity in molybdenum disulfide by electrochemical intercalation
Zhu, G., Líu, J., Zheng, Q., Zhang, R., Li, D., Banerjee, D., & Cahill, D. G. (2016) · Nature Communications · doi:10.1038/ncomms13211 · Cited by 201 · see citing works
Thermal property microscopy with frequency domain thermoreflectance
Yang, J., Maragliano, C., & Schmidt, A. J. (2013) · Review of Scientific Instruments · doi:10.1063/1.4824143 · Cited by 176 · see citing works
Self-citationJiang, P., Qian, X., & Yang, R. (2017) · Review of Scientific Instruments · doi:10.1063/1.4991715 · Cited by 175 · see citing works
Self-citationUncertainty analysis of thermoreflectance measurements
Yang, J., Ziade, E., & Schmidt, A. J. (2016) · Review of Scientific Instruments · doi:10.1063/1.4939671 · Cited by 174 · see citing works
Self-citationQian, X., Jiang, P., & Yang, R. (2017) · Materials Today Physics · doi:10.1016/j.mtphys.2017.12.005 · Cited by 174 · see citing works
Self-citationLow Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices
Yates, L., Anderson, J., Gu, X., Lee, C., Bai, T., Mecklenburg, M. H., Aoki, T., Goorsky, M. S., Kuball, M., Piner, E. L., et al. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b07014 · Cited by 171 · see citing works
Self-citationChiral-phonon-activated spin Seebeck effect
Kim, K., Vetter, E. P., Yan, L., Yang, C., Wang, Z., Sun, R., Yang, Y. M., Comstock, A. H., Li, X., Zhou, J., et al. (2023) · Nature Materials · doi:10.1038/s41563-023-01473-9 · Cited by 168 · see citing works
A steady-state thermoreflectance method to measure thermal conductivity
Braun, J. L., OLSON, D. H. L., Gaskins, J. T., & Hopkins, P. E. (2019) · Review of Scientific Instruments · doi:10.1063/1.5056182 · Cited by 160 · see citing works
Size effects on the thermal conductivity of amorphous silicon thin films
Braun, J. L., Baker, C. H., Giri, A., Elahi, M. M. M., Artyushkova, K., Beechem, T. E., Norris, P. M., Leseman, Z. C., Gaskins, J. T., & Hopkins, P. E. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.140201 · Cited by 137 · see citing works
Tan, M., Chen, D., Cheng, Y. S., Sun, H., Chen, G., Dong, S., Zhao, G., Sun, B., Wu, S., Zhang, W., et al. (2022) · Advanced Functional Materials · doi:10.1002/adfm.202202057 · Cited by 124 · see citing works
Sandell, S., Chávez‐Ángel, E., Sachat, A. E., He, J., Torres, C. M. S., & Maire, J. K. (2020) · Journal of Applied Physics · doi:10.1063/5.0020239 · Cited by 124 · see citing works
Two-channel model for nonequilibrium thermal transport in pump-probe experiments
Wilson, R. B., Feser, J. P., Hohensee, G. T., & Cahill, D. G. (2013) · Physical Review B · doi:10.1103/physrevb.88.144305 · Cited by 112 · see citing works
Wei, C., Zheng, X., Cahill, D. G., & Zhao, J.-C. (2013) · Review of Scientific Instruments · doi:10.1063/1.4815867 · Cited by 110 · see citing works
Liu, J., Yoon, B., Kuhlmann, E., Tian, M., Zhu, J., George, S. M., Lee, Y.-C., & Yang, R. (2013) · Nano Letters · doi:10.1021/nl403244s · Cited by 105 · see citing works
Self-citationNon-contact methods for thermal properties measurement
Mayor, B. A., Borca-Tasciuc, D. A., & Martín‐González, M. (2017) · Renewable and Sustainable Energy Reviews · doi:10.1016/j.rser.2017.03.027 · Cited by 102 · see citing works
A Review of Self-Heating Effects in Advanced CMOS Technologies
Prasad, C. (2019) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2019.2943744 · Cited by 100 · see citing works
Zhu, J., Wu, X., Lattery, D. M., Zheng, W., & Wang, X. (2017) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2017.1313343 · Cited by 91 · see citing works
Self-citationBougher, T. L., Yates, L., Lo, C.-F., Johnson, W. J., Graham, S. L., & Cola, B. A. (2016) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2016.1154630 · Cited by 91 · see citing works
OLSON, D. H. L., Braun, J. L., & Hopkins, P. E. (2019) · Journal of Applied Physics · doi:10.1063/1.5120310 · Cited by 90 · see citing works
Cheng, Z., Bai, T., Shi, J., Feng, T., Wang, Y., Mecklenburg, M. H., Li, C., Hobart, K. D., Feygelson, T. I., Tadjer, M. J., et al. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.9b02234 · Cited by 87 · see citing works
Wang, H., Chu, W., & Chen, G. (2019) · Advanced Electronic Materials · doi:10.1002/aelm.201900167 · Cited by 83 · see citing works
Anaya, J., Bai, T., Wang, Y., Li, C., Goorsky, M. S., Bougher, T. L., Yates, L., Cheng, Z., Graham, S. L., Hobart, K. D., et al. (2017) · Acta Materialia · doi:10.1016/j.actamat.2017.08.007 · Cited by 82 · see citing works
Yuan, C., Hanus, R. C., & Graham, S. L. (2022) · Journal of Applied Physics · doi:10.1063/5.0122200 · Cited by 82 · see citing works
Heteroepitaxial growth of β-Ga2O3 films on SiC via molecular beam epitaxy
Nepal, N., Katzer, D. S., Downey, B. P., Wheeler, V. D., Nyakiti, L. O., Storm, D. F., Hardy, M. T., Freitas, J. A., Jin, E. N., Vaca, D., et al. (2020) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/6.0000452 · Cited by 77 · see citing works
Rodin, D. M., & Yee, S. K. (2017) · Review of Scientific Instruments · doi:10.1063/1.4973297 · Cited by 73 · see citing works
Self-heating in advanced CMOS technologies
Prasad, C., Ramey, S., & Jiang, L. (2017) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2017.7936336 · Cited by 70 · see citing works
Braun, J. L., Szwejkowski, C. J., Giri, A., & Hopkins, P. E. (2017) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4038713 · Cited by 69 · see citing works
Jiang, P., Huang, B., & Koh, Y. K. (2016) · Review of Scientific Instruments · doi:10.1063/1.4954969 · Cited by 66 · see citing works
Wang, L., Cheaito, R., Braun, J. L., Giri, A., & Hopkins, P. E. (2016) · Review of Scientific Instruments · doi:10.1063/1.4962711 · Cited by 63 · see citing works
A review of thermal properties of CVD diamond films
Zhang, C., Vispute, R. D., Fu, K. K., & Ni, C. (2023) · Journal of Materials Science · doi:10.1007/s10853-023-08232-w · Cited by 61 · see citing works
Local measurement of thermal conductivity and diffusivity
Hurley, D. H., Schley, R., Khafizov, M., & Wendt, B. (2015) · Review of Scientific Instruments · doi:10.1063/1.4936213 · Cited by 59 · see citing works
Phonon hydrodynamics in frequency-domain thermoreflectance experiments
Beardo, A., Hennessy, M. G., Sendra, L., Camacho, J., Myers, T. G., Bafaluy, J., & Álvarez, F. X. (2020) · Physical review. B./Physical review. B · doi:10.1103/physrevb.101.075303 · Cited by 57 · see citing works
Size effect on the thermal conductivity of ultrathin polystyrene films
Líu, J., Ju, S., Ding, Y., & Yang, R. (2014) · Applied Physics Letters · doi:10.1063/1.4871737 · Cited by 56 · see citing works
Self-citationDeCoster, M. E., Meyer, K., Piercy, B. D., Gaskins, J. T., Donovan, B., Giri, A., Strnad, N. A., Potrepka, D. M., Wilson, A. A., Losego, M. D., et al. (2018) · Thin Solid Films · doi:10.1016/j.tsf.2018.01.058 · Cited by 54 · see citing works
Siddique, A., Ahmed, R., Anderson, J., Nazari, M., Yates, L., Graham, S. L., Holtz, M. W., & Piner, E. L. (2019) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.9b00131 · Cited by 53 · see citing works
Ziade, E. (2020) · Review of Scientific Instruments · doi:10.1063/5.0021917 · Cited by 50 · see citing works
Ferroelectric Domain Wall Engineering Enables Thermal Modulation in PMN–PT Single Crystals
Negi, A., Kim, H. P., Hua, Z., Timofeeva, A., Zhang, X., Zhu, Y., Peters, K. J., Kumah, D. P., Jiang, X., & Líu, J. (2023) · Advanced Materials · doi:10.1002/adma.202211286 · Cited by 47 · see citing works
Bury, E., Kaczer, B., Roussel, P. J., Ritzenthaler, R., Raleva, K., Vasileska, D., & Groeseneken, G. (2014) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.2014.6861186 · Cited by 46 · see citing works
Heat conduction of electrons and phonons in thermal interface materials
Zhao, Y., Zeng, X., Ren, L., Xia, X., Zeng, X., & Zhou, J. (2021) · Materials Chemistry Frontiers · doi:10.1039/d0qm01136c · Cited by 45 · see citing works
Suppressed electronic contribution in thermal conductivity of Ge2Sb2Se4Te
Aryana, K., Zhang, Y., Tomko, J. A., Hoque, M. S. B., Hoglund, E. R., OLSON, D. H. L., Nag, J., Read, J. C., Rı́os, C., Hu, J., et al. (2021) · Nature Communications · doi:10.1038/s41467-021-27121-x · Cited by 45 · see citing works
Shen, W., Vaca, D., & Kumar, S. (2020) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2020.1807662 · Cited by 43 · see citing works
Thermal conductivity modeling of hybrid organic-inorganic crystals and superlattices
Qian, X., Gu, X., & Yang, R. (2017) · Nano Energy · doi:10.1016/j.nanoen.2017.09.047 · Cited by 41 · see citing works
Self-citationA thin film efficient pn-junction thermoelectric device fabricated by self-align shadow mask
Kogo, G., Xiao, B., Danquah, S. A., Lee, H. O., Niyogushima, J. C., Yarbrough, K. A., Candadai, A. A., Marconnet, A. M., Pradhan, S. K., & Bahoura, M. J. (2020) · Scientific Reports · doi:10.1038/s41598-020-57991-y · Cited by 42 · see citing works
OLSON, D. H. L., Gaskins, J. T., Tomko, J. A., Opila, E. J., Golden, R. A., Harrington, G. J. K., Chamberlain, A. L., & Hopkins, P. E. (2019) · Scripta Materialia · doi:10.1016/j.scriptamat.2019.10.027 · Cited by 41 · see citing works
Anisotropic thermal transport in van der Waals layered alloys WSe2(1-<i>x</i>)Te2<i>x</i>
Qian, X., Jiang, P., Yu, P., Gu, X., Liu, Z., & Yang, R. (2018) · Applied Physics Letters · doi:10.1063/1.5028258 · Cited by 41 · see citing works
Self-citationChen, J.-Y., Zhu, J., Zhang, D., Lattery, D. M., Li, M., Wang, J.-P., & Wang, X. (2016) · The Journal of Physical Chemistry Letters · doi:10.1021/acs.jpclett.6b00945 · Cited by 38 · see citing works
Self-citationPang, Y., Jiang, P., & Yang, R. (2021) · Journal of Applied Physics · doi:10.1063/5.0057796 · Cited by 37 · see citing works
Self-citationIn situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging
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Mohan, R., Khan, S., Wilson, R., & Hopkins, P. (2025) · Nature Reviews Methods Primers · doi:10.1038/s43586-025-00425-8 · Cited by 38 · see citing works
Significantly reduced thermal conductivity in β -(Al0.1Ga0.9)2O3/Ga2O3 superlattices
Cheng, Z., Tanen, N. J., Chang, C. S., Shi, J., McCandless, J. P., Muller, D. A., Jena, D., Xing, H. G., & Graham, S. L. (2019) · Applied Physics Letters · doi:10.1063/1.5108757 · Cited by 32 · see citing works
Efficient thermal conductance in organometallic perovskite CH3NH3PbI3 films
Chen, Q. H., Zhang, C., Zhu, M., Liu, S., Siemens, M. E., Gu, S., Zhu, J., Shen, J., Wu, X., Liao, C., et al. (2016) · Applied Physics Letters · doi:10.1063/1.4942779 · Cited by 28 · see citing works
Self-citationFan, X., Zhang, Z., Zhu, J., Yuan, K., Zhou, J., Zhang, X., & Tang, D. (2022) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2022.107558 · Cited by 29 · see citing works
Self-citationNegi, A., Rodriguez, A. D., Zhang, X., Comstock, A. H., Yang, C., Sun, D., Jiang, X., Kumah, D. P., Hu, M., & Líu, J. (2023) · Advanced Science · doi:10.1002/advs.202301273 · Cited by 29 · see citing works
Chen, T., Song, S., Shen, Y. S., Zhang, K., & Jiang, P. (2024) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2024.107849 · Cited by 28 · see citing works
Thermal transport across nanoscale damage profile in sapphire irradiated by swift heavy ions
Abdullaev, A., Chauhan, V. S., Muminov, B., O'Connell, J. H., Skuratov, V. A., Khafizov, M., & Utegulov, Z. N. (2020) · Journal of Applied Physics · doi:10.1063/1.5126413 · Cited by 28 · see citing works
Review—Integration Methods of GaN and Diamond for Thermal Management Optimization
Tijent, F. Z., Faqir, M., Chouiyakh, H., & Essadiqi, E. H. (2021) · ECS Journal of Solid State Science and Technology · doi:10.1149/2162-8777/ac12b3 · Cited by 27 · see citing works
Scott, E. A., Smith, S. W., Henry, M. D., Rost, C. M., Giri, A., Gaskins, J. T., Fields, S. S., Jaszewski, S. T., Ihlefeld, J. F., & Hopkins, P. E. (2018) · Applied Physics Letters · doi:10.1063/1.5052244 · Cited by 27 · see citing works
Picosecond transient thermoreflectance for thermal conductivity characterization
Jeong, J., Meng, X., Rockwell, A. K., Bank, S. R., Hsieh, W.-P., Lin, J.-F., & Wang, Y. (2019) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2019.1580807 · Cited by 26 · see citing works
Spatial Mapping of Thermal Boundary Conductance at Metal–Molybdenum Diselenide Interfaces
Brown, D. B., Shen, W., Li, X., Xiao, K., Geohegan, D. B., & Kumar, S. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b22702 · Cited by 26 · see citing works
Park, K., & Bayram, C. (2019) · Journal of Applied Physics · doi:10.1063/1.5126970 · Cited by 26 · see citing works
Braun, J. L., King, S. W., Hoglund, E. R., Gharacheh, M. A., Scott, E. A., Giri, A., Tomko, J. A., Gaskins, J. T., Al-kukhun, A., Bhattarai, G., et al. (2021) · Physical Review Materials · doi:10.1103/physrevmaterials.5.035604 · Cited by 26 · see citing works
Graphene Layer Number-Dependent Heat Transport across Nickel/Graphene/Nickel Interfaces
Zhou, J., Yang, K., Yang, B., Zhong, B., Yao, S., Ma, Y., Song, J., Fan, T., Tang, D., Zhu, J., et al. (2022) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.2c07796 · Cited by 26 · see citing works
Self-citationA short account of thermoelectric film characterization techniques
Nandihalli, N. (2023) · Materials Today Physics · doi:10.1016/j.mtphys.2023.101173 · Cited by 26 · see citing works
OLSON, D. H. L., Rost, C. M., Gaskins, J. T., Szwejkowski, C. J., Braun, J. L., & Hopkins, P. E. (2018) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2018.2863648 · Cited by 26 · see citing works
Braun, J. L., King, S. W., Giri, A., Gaskins, J. T., Sato, M., Fujiseki, T., Fujiwara, H., & Hopkins, P. E. (2016) · Applied Physics Letters · doi:10.1063/1.4967309 · Cited by 25 · see citing works
In-Plane Thermoelectric Properties of Flexible and Room-Temperature-Doped Carbon Nanotube Films
Chatterjee, K., Negi, A., Kim, K., Líu, J., & Ghosh, T. K. (2020) · ACS Applied Energy Materials · doi:10.1021/acsaem.0c00995 · Cited by 25 · see citing works
Decoupling thermal properties in multilayered systems for advanced thermoreflectance experiments
Chen, T., & Jiang, P. (2025) · Physical Review Applied · doi:10.1103/physrevapplied.23.044004 · Cited by 24 · see citing works
Ireland, R. M., Liu, Y., Guo, X. W., Cheng, Y., Kola, S., Wang, W., Jones, T., Yang, R., Falk, M. L., & Katz, H. E. (2015) · Advanced Science · doi:10.1002/advs.201500015 · Cited by 24 · see citing works
Self-citationSubramanyan, H., Kim, K., Lu, T., Zhou, J., & Líu, J. (2019) · AIP Advances · doi:10.1063/1.5121727 · Cited by 24 · see citing works
Thermal transport in metal halide perovskites and other third-generation photovoltaic materials
Chen, D., Li, S., Li, B., & Guo, P. (2024) · Applied Physics Reviews · doi:10.1063/5.0226632 · Cited by 21 · see citing works
Simultaneous measurement of thermal conductivity and heat capacity by flash thermal imaging methods
Tao, N. P., Li, X. L., & Sun, J. G. (2017) · Review of Scientific Instruments · doi:10.1063/1.4985633 · Cited by 21 · see citing works
Simultaneous Measurement of Thermal Conductivity and Specific Heat in a Single TDTR Experiment
Sun, F., Wang, X., Yang, M., Chen, Z., Zhang, H., & Tang, D. (2017) · International Journal of Thermophysics · doi:10.1007/s10765-017-2328-1 · Cited by 21 · see citing works
Oxidation limited thermal boundary conductance at metal-graphene interface
Brown, D. B., Bougher, T. L., Cola, B. A., & Kumar, S. (2018) · Carbon · doi:10.1016/j.carbon.2018.08.002 · Cited by 21 · see citing works
Achieving Minimal Heat Conductivity by Ballistic Confinement in Phononic Metalattices
Chen, W., Talreja, D., Eichfeld, D. A., Mahale, P., Nova, N. N., Cheng, H. Y., Dysart, J. L., Yu, S.-Y., Poilvert, N., Mahan, G. D., et al. (2020) · ACS Nano · doi:10.1021/acsnano.9b09487 · Cited by 20 · see citing works
Strained Polymer Thermal Conductivity Enhancement Counteracted by Additional Off-Axis Strain
Donovan, B., Warzoha, R. J., Cosby, T., Giri, A., Wilson, A. A., Borgdorff, A. J., Vu, N. T., Patterson, E. A., & Gorzkowski, E. P. (2020) · Macromolecules · doi:10.1021/acs.macromol.0c01243 · Cited by 17 · see citing works
Sensing depths in frequency domain thermoreflectance
Hodges, W., Jarzembski, A., McDonald, A. E., Ziade, E., & Pickrell, G. W. (2022) · Journal of Applied Physics · doi:10.1063/5.0088594 · Cited by 16 · see citing works
Time-domain thermoreflectance (TDTR) data analysis using phonon hydrodynamic model
Xiang, Z., Jiang, P., & Yang, R. (2022) · Journal of Applied Physics · doi:10.1063/5.0113257 · Cited by 16 · see citing works
Self-citationChen, T., Song, S., Hu, R., & Jiang, P. (2024) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2024.109347 · Cited by 16 · see citing works
Structure-thermal property correlation of aligned silicon dioxide nanorod arrays
Zhu, J., Zhu, Y., Wu, X., Song, H., Zhang, Y., & Wang, X. (2016) · Applied Physics Letters · doi:10.1063/1.4953625 · Cited by 16 · see citing works
Self-citationBrown, D. B., Bougher, T. L., Zhang, X., Ajayan, P. M., Cola, B. A., & Kumar, S. (2019) · physica status solidi (a) · doi:10.1002/pssa.201900446 · Cited by 16 · see citing works
Thermal Conductivity of Polyurethane Thin Films
Zhou, J., Li, X., Chen, C., Zhou, W., Fielitz, T. R., Braun, P. V., & Cahill, D. G. (2024) · Macromolecules · doi:10.1021/acs.macromol.4c00401 · Cited by 15 · see citing works
Negi, A., Yan, L., Yang, C., Yu, Y., Kim, D., Mukherjee, S., Comstock, A. H., Raza, S., Wang, Z., Sun, D., et al. (2024) · ACS Nano · doi:10.1021/acsnano.3c12172 · Cited by 15 · see citing works
Thermoelectric Properties of Amorphous Zr-Ni-Sn Thin Films Deposited by Magnetron Sputtering
Zhou, Y., Tan, Q., Zhu, J., Li, S., Liu, C., Lei, Y., & Li, L. (2015) · Journal of Electronic Materials · doi:10.1007/s11664-014-3610-7 · Cited by 14 · see citing works
Self-citationWang, X., Chen, Z., Sun, F., Zhang, H., Jiang, Y., & Tang, D. (2017) · Measurement Science and Technology · doi:10.1088/1361-6501/aa9e18 · Cited by 13 · see citing works
Pfeifer, T. W., Schonfeld, H. B., Scott, E. A., Aller, H. T., Gaskins, J. T., OLSON, D. H. L., Braun, J. L., Graham, S. L., & Hopkins, P. E. (2025) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-080423-010435 · Cited by 13 · see citing works
Zhou, J., Fan, X., Zhang, Z., Li, D., Zhu, J., & Tang, D. (2023) · Journal of Applied Physics · doi:10.1063/5.0145266 · Cited by 13 · see citing works
Self-citationTu, J., Haque, M. A., Baran, D., & Ong, W. (2023) · Fundamental Research · doi:10.1016/j.fmre.2023.01.010 · Cited by 11 · see citing works
Zeng, Y., Li, L., Wang, S., Sun, F., Wang, Z., Tu, X., & Li, C. (2024) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2024.125542 · Cited by 11 · see citing works
Zhou, J., Zhao, H., Fan, X., Yuan, K., Wang, Z., Zhang, Z., Li, D., Zhang, X., Chen, H., Tang, D., et al. (2023) · Materials Today Physics · doi:10.1016/j.mtphys.2023.101272 · Cited by 11 · see citing works
Self-citationWang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., & Dauskardt, R. H. (2023) · Small · doi:10.1002/smll.202301383 · Cited by 10 · see citing works
Recent Progress in Modulated Photothermal Radiometry
Corona, J., & Kandadai, N. (2023) · Sensors · doi:10.3390/s23104935 · Cited by 10 · see citing works
Martan, J. (2015) · Review of Scientific Instruments · doi:10.1063/1.4904876 · Cited by 10 · see citing works
- Authors
- Liu, J., Zhu, J., Tian, M., Gu, X., Schmidt, A., & Yang, R.
- Affiliations
- University of Colorado 1 Department of Mechanical Engineering, , Boulder, Colorado 80309, USA
- Chinese Academy of Sciences (CN)
- University of Colorado Boulder (US)
- Boston University (US)
- Venue
- Review of Scientific Instruments
- Publisher
- AIP Publishing
- Published
- 2013-03-01
- Volume
- 84
- Issue
- 3
- Pages
- 034902-034902
- ISSN
- 0034-6748 (ISSN-L)
- 1089-7623
- OpenAlex
- W2076220136
- Cited by
- 163
- References
- 26
- Citations by year
- 2026: 8 · 2025: 15 · 2024: 12 · 2023: 15 · 2022: 13 · 2021: 11 · 2020: 14 · 2019: 18 · 2018: 11 · 2017: 17 · 2016: 13 · 2015: 8 · 2014: 3 · 2013: 5
- FWCI
- 4.36
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Review of Scientific Instruments (publishedVersion)
- PubMed (publishedVersion)
- Funders
- National Natural Science Foundation of China (51206167)
- National Science Foundation (0846561)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
- Keywords
- thermal conductivity, volumetric heat capacity, transient thermoreflectance, thin films, bulk materials, simultaneous measurement, atomic layer deposition, molecular layer deposition, silica, silicon
- MeSH terms
- Electric Conductivity, Equipment Design, Hot Temperature, Materials Testing, Silicon Dioxide, Silicon, Temperature, Thermal Conductivity, Nanotechnology, Nanostructures
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