Epidermal Electronics with Advanced Capabilities in Near-Field Communication
Abstract
Epidermal electronics with advanced capabilities in near field communications (NFC) are presented. The systems include stretchable coils and thinned NFC chips on thin, low modulus stretchable adhesives, to allow seamless, conformal contact with the skin and simultaneous capabilities for wireless interfaces to any standard, NFC-enabled smartphone, even under extreme deformation and after/during normal daily activities.
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FEA results demonstrated that the maximum strain in the copper layer was below the elastic limit (0.3%) under all loading conditions.
“FEA results demonstrated that the maximum strain in the copper layer was below the elastic limit (0.3%) under all loading conditions (fig. S5) (39).”
From A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat (2016) · cites this paper as [39]
The previously reported ultrathin NFC electronics integrated on the top of the microfluidic device enabled wireless communication to external devices, with stable operation and a soft, biocompatible set of mechanical properties, even under a 30% strain condition.
“The previously reported ultrathin NFC electronics (39) integrated on the top of the microfluidic device enabled wireless communication to external devices, with stable operation and a soft, biocompatible set of mechanical properties, even under a 30% strain condition (39).”
From A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat (2016) · cites this paper as [39]
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- Authors
- Kim, J., Banks, A., Cheng, H., Xie, Z., Xu, S., Jang, K.-I., Lee, J. W., Liu, Z., Gutruf, P., Huang, X., Wei, P., Liu, F., Li, K., Dalal, M., Ghaffari, R., Feng, X., Huang, Y., Gupta, S., Paik, U., & Rogers, J. A.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Northwestern University (US)
- Department of Materials Science and Engineering; Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA
- Institute of High Performance Computing (SG)
- RMIT University (AU)
- MC10 (United States) (US)
- Tsinghua University (CN)
- Hanyang University (KR)
- Corresponding author
- Paik, Ungyu
- Rogers, John A.
- ORCID
- Venue
- Small
- Publisher
- Wiley
- Published
- 2014-11-03
- Volume
- 11
- Issue
- 8
- Pages
- 906-912
- ISSN
- 1613-6810 (ISSN-L)
- OpenAlex
- W2168743033
- Cited by
- 274
- References
- 14
- Citations by year
- 2026: 7 · 2025: 19 · 2024: 14 · 2023: 15 · 2022: 17 · 2021: 42 · 2020: 22 · 2019: 37 · 2018: 28 · 2017: 21 · 2016: 40 · 2015: 12
- FWCI
- 12.64
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Small (publishedVersion)
- PubMed (publishedVersion)
- RMIT Research Repository (RMIT University Library) (submittedVersion)
- Figshare (submittedVersion)
- Cambridge University Engineering Department Publications Database (submittedVersion)
- KAIST Institutional Repository (KAIST) (submittedVersion)
- Topics
- Physical Sciences › Engineering › Biomedical Engineering › Advanced Sensor and Energy Harvesting Materials
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Nanomaterials and Printing Technologies
- Physical Sciences › Engineering › Media Technology › RFID technology advancements
- Keywords
- epidermal electronics, near field communication, wireless charging, smartphone charging, wearable electronics, skin deformation
- MeSH terms
- Biomedical Engineering, Communication, Computer Communication Networks, Dimethylpolysiloxanes, Electronics, Humans, Photochemistry, Polyethylene Terephthalates, Pressure, Skin, Solubility, Telemetry, Water, Monitoring, Ambulatory, Optics and Photonics
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