Cited by 544Neuroscience and Neural EngineeringAnalog and Mixed-Signal Circuit DesignAdvanced MEMS and NEMS Technologies

An Integrated-Circuit Approach to Extracellular Microelectrodes

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Wise, Kensall D., Angell, James B., Starr, Arnold·1970·IEEE Transactions on Biomedical Engineering

Abstract

This paper describes a new multielectrode microprobe which utilizes integrated-circuit fabrication techniques to overcome many of the problems associated with conventional microelectrodes. The probe structure consists of an array of gold electrodes which are supported on a silicon carrier and which project beyond the carrier for a distance of about 50 μ to allow a close approach to active neurons. These electrodes are covered with a thin (0.4-μ) layer of silicon dioxide which is selectively removed at the electrode tips using high-resolution photoengraving techniques to define the recording areas precisely. The processing sequence described permits any two-dimensional electrode array to be realized. Interelectrode spacings can be accurately controlled in the range from 10 to 20 μ or larger, and electrode-tip diameters can be as small as 2 μ.

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Integrity signals

Registry

Crossref · 10.1109/tbme.1970.4502738

Cites

14 of 14 references verified0 citation errors · 0 not checkable

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  • Neuroscience studies commonly place electrodes into specific cortical regions to record neural electrical activity.

    “Typical neuroscience studies involve inserting electrodes [10, 90, 144] into specific regions of the cortex to acquire neural electrical activity.”

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Cites

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Research works printed but not linked: 4

  1. W. L. Nastuk, Ed. New York: Academic Press, 1964, ch. 2.
  2. R. C. G. Swann, R. R. Mehta, and T. P. Cauge, "The prepara- tion and properties of thin film silicon-nitrogen compotunds pro- duced by a radio frequency flow discharge reaction," J. Elec- trochem. Soc., vol. 114, pp. 713-717, 1967.
  3. WV. L. Nastuk, Ed. New Y ork: Academic Press, 1964, ch. 3.
  4. D. A. Robinson, "The electrical properties of miietal microelec- trodes," Proc. IEEE, vol. 56, pp. 1065-1071, June 1968.

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Authors
Wise, K. D., Angell, J. B., & Starr, A.
Affiliations
  • Stanford University (US)
  • Stanford Medicine (US)
Venue
IEEE Transactions on Biomedical Engineering
Published
1970-07
Volume
BME-17
Issue
3
Pages
238-247
ISSN
  • 0018-9294 (ISSN-L)
  • 1558-2531
OpenAlex
W2053012273
Cited by
544
References
14
Citations by year
2026: 12 · 2025: 28 · 2024: 23 · 2023: 19 · 2022: 29 · 2021: 22 · 2020: 22 · 2019: 28 · 2018: 18 · 2017: 16 · 2016: 16 · 2015: 19 · 2014: 22 · 2013: 24 · 2012: 12
FWCI
1.02
Type
journal article
Language
en
Open access
Locations
  • IEEE Transactions on Biomedical Engineering (publishedVersion)
  • PubMed (publishedVersion)
  • eScholarship (California Digital Library) (submittedVersion, cc-by)
Topics
  • Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
  • Physical Sciences › Engineering › Biomedical Engineering › Analog and Mixed-Signal Circuit Design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
Keywords
integrated circuit fabrication, silicon dioxide etching, photoengraving, electrode spacing, neural recording
MeSH terms
Animals, Biomedical Engineering, Cats, Electrodes, Electronics, Medical, Neurophysiology

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