The DOI matches its Crossref record; 133 of the 133 references it cites were found in a registry or an index; 4 of the 106 sources its claims cite were checked for support.
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
Open accessAbstract
Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source (TPS) method are most used. For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties needs to be based on: (1) knowledge on the sample whose thermophysical properties are to be determined, including the sample geometry and size, and the material preparation method; (2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; and (3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.
Overview
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Written from the paper’s full text.
TL;DR
This review surveys commonly used techniques for measuring thermal conductivity and interfacial thermal conductance of bulk and thin-film solid-state materials. It compares steady-state and transient methods, their sample requirements, data-reduction models, and error sources, noting that determining these properties with less than 5% error is generally very challenging.
Key findings
- For bulk materials, the most-used techniques reviewed are steady-state methods (absolute, comparative, radial heat flow, parallel thermal conductance), transient hot-wire, laser flash diffusivity, and transient plane source (TPS); for thin films, the 3ω method and transient thermoreflectance in time-domain (TDTR) and frequency-domain (FDTR) are widely employed.
- Reported performance numbers include: hot-wire uncertainties below 1% for gases, liquids, and solids and below 2% for nanofluids; laser flash uncertainty less than 3% over -120 °C to 2800 °C and for samples 5–12 mm in diameter; pulsed power uncertainty less than 3% over 1.9–390 K and capable of measuring 0.004 W/m·K for ZrW2O8 at 2 K; TPS for 0.005–500 W/m·K from cryogenic temperatures to 500 K; and 3ω radiation error less than 2% even at 1000 K.
- Thermal conductivity of solids spans about 0.015 W/m·K for aerogels to about 2000 W/m·K for diamond and about 3000 W/m·K for single-layer graphene at room temperature.
- The paper emphasizes that technique selection depends on sample geometry/size and preparation, the fundamentals and limits of the testing method, and potential error sources such as convection and radiation heat losses.
Methods
- Design: a review article, not a primary experimental study; it describes principles, schematics, governing equations, and data-reduction approaches for bulk and thin-film thermal characterization techniques.
- Data or sample: the paper draws on published literature and standards (e.g., ASTM, ISO, EN) rather than reporting a new sample set or original measurements.
- Main analysis: qualitative and analytical comparison of steady-state and transient methods, including equations for Fourier’s law, hot-wire, TPS, laser flash, 3ω, and thermoreflectance models, plus discussion of measurement uncertainty and sensitivity.
Limitations
- The paper states that determining thermal conductivity and interfacial thermal conductance with less than 5% error is very challenging, and that parasitic heat losses, sample geometry, contact resistance, and other error sources can affect results.
- Technique-specific limitations stated include: absolute steady-state methods require relatively large samples and long waiting times; TPS requires planar sample sides and suffers from contact resistance, sensor thermal inertia, and electrical resistance changes; laser flash requires separate density and heat capacity measurements and can suffer from sample-holder heating; 3ω requires microfabrication and an insulating layer for electrically conducting or semiconducting samples; thermoreflectance requires a metal transducer and model fitting with sensitivity limitations.
- Evident from the text: the review covers selected commonly used techniques rather than all possible methods, and several quantitative uncertainty values are cited from prior literature rather than newly validated in this work.
Model-written summary. Check it against the paper before relying on it.
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Claims the paper makes
4 of 106 cited sources checked · 2 supported · 0 flagged · accuracy not yet measured
The cited sources support only part of this claim — read each source’s verdict below.
In the paper
“The TPS method was reported to be capable for measuring materials with thermal conductivity ranging from 0.005 to 500 W/m • K in the temperature range from cryogenic temperatures to 500 K, including liquids, aerogels and solids [59][60][61][62].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
What the sources say
- Not checked — no full text of the sourcecites [59] 1991, Transient Plane Source Techniques for Thermal Conductivity and Thermal Diffusivity Measurements of Solid Materials, Rev. Sci. Instrum. source
- Not checked — no full text of the sourcecites [60] 1994, Thermal Conductivity, Thermal Diffusivity, and Specific Heat of Thin Samples From Transient Measurements With Hot Disk Sensors, Rev. Sci. Instrum. source
- Partly supportedcites [62] 2014, Improving the Accuracy of the Transient Plane Source Method by Correcting Probe Heat Capacity and Resistance Influences, Meas. Sci. Technol. sourceExperimental — accuracy not yet measured
The Introduction describes TPS as a thermal-conductivity measurement method and says transient-state methods apply to solids and liquids. The Abstract also describes TPS as applicable to solid and liquid materials. Our copy does not give the claimed 0.005–500 W/m·K range, a range from cryogenic temperatures to 500 K, or aerogels. (LLM, conf=0.86)
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passes- The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
The cited sources support only part of this claim — read each source’s verdict below.
In the paper
“This change in voltage at 3ω frequency (i.e. the third term in Eq. ( 23)) has the information about thermal transport within the sample [82].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
What the sources say
- Partly supportedcites [82] 2003, Nanoscale Thermal Transport, J. Appl. Phys. sourceExperimental — accuracy not yet measured
The Multilayers and superlattices section (page unavailable) says the 3ω method measures thermal conductivity in thin films, supporting the claim that the method yields information about sample thermal transport. Our copy does not explain that this information is carried specifically by a voltage signal at 3ω. (LLM, conf=0.76)
Tests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passes- Partly supported
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“This technique is capable of measuring a wide temperature range from 1.9 to 390 K as reported in literature [42][43][44]”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [42] 2012, Low-Temperature Investigations of the Open-Framework Material HfMgMo3O12, Solid State Commun. source
- Not checked — no full text of the sourcecites [43] 2005, Unusual Thermal Conductivity of the Negative Thermal Expansion Material, ZrW2O8, Solid State Commun. source
- Not checked — no full text of the sourcecites [44] 2012, Characterization of Thermal Performance of a Solid–Solid Phase Change Material, Di-n-Hexylammonium Bromide, for Potential Integration in Building Materials, Thermochim. Acta source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passes- The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
- The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Since the temperature increase of the metal disk is highly dependent on the two testing samples attached to it, thermal properties of the testing samples can be determined by monitoring the temperature increase for a short time period.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
Tests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passes- The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Besides the convection and radiation heat losses, another concern is that the heat conduction through thermocouple wires.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIn the paper
“The laser flash method employs non-contact, non-destructive temperature sensing to achieve high accuracy [65].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [65] 2007, A New Laser Flash System for Measurement of the Thermophysical Properties, Thermochim. Acta source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesThe paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The conventional thermal conductivity measurement techniques for bulk materials are usually too large in size to measure the temperature drop and the heat flux across a length scale ranging from a few nanometers to tens of microns.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 1. Introduction
Tests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesThe paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“However, if one has a standard material whose thermal conductivity is known, the comparative cut bar technique can be applied and the direct measurement of heat flow is unnecessary.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.2 Comparative technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIn the paper
“This makes it difficult for some materials, especially powders or granules [64].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
What the sources say
- Not checked — no full text of the sourcecites [64] 2014, Textural and Thermal Conductivity Properties of a Low Density Mesoporous Silica Material, Energy Build. source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesThe paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The major drawback of this method is the requirement to measure cross-sectional area of such small samples.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.4 Parallel thermal conductance technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passes
- It may state two separate claims as one. 28
- Probably not a substantial claim. 58
- The quote only partly states this claim. 1
The sources with a verdict support this claim; the rest weren’t checked yet, have no full text we could read, or their verdicts aren’t rated yet.
In the paper
“This technique has recently been further developed over the last few years for measuring anisotropic thermal conductivity of thin films [97][98][99] and probing spectral phonon transport [100-103].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
What the sources say
- Not checked — no full text of the sourcecites [97] 2010, Characterization of Thin Metal Films Via Frequency-Domain Thermoreflectance, J. Appl. Phys. source
- Not checked — no full text of the sourcecites [98] 2008, Pulse Accumulation, Radial Heat Conduction, and Anisotropic Thermal Conductivity in Pump-Probe Transient Thermoreflectance, Rev. Sci. Instrum. source
- Not checked — no full text of the sourcecites [99] 2010, Quasi-Ballistic Thermal Transport From Nanoscale Interfaces Observed Using Ultrafast Coherent Soft X-Ray Beams, Nat. Mater. source
- Supportedcites [100] 2015, A New Regime of Nanoscale Thermal Transport: Collective Diffusion Increases Dissipation Efficiency, Proc. Natl. Acad. Sci. source
The citation to this paper falls in the [100–103] group for probing spectral phonon transport, not the [97–99] group for anisotropic thin-film conductivity. The Introduction says the authors extract contributions from specific regions of the phonon mean-free-path spectrum, and the Discussion describes measuring those contributions for different phonon modes. (LLM, conf=0.93)
- Supportedcites [101] 2014, Anisotropic Failure of Fourier Theory in Time-Domain Thermoreflectance Experiments, Nat. Commun. source
The citation is attached to the spectral-phonon-transport part of the sentence. The paper’s Discussion states that TDTR observations are sensitive to phonon mean-free-path distributions and discusses using TDTR as a mean-free-path spectroscopy technique. Its experiments examine how phonon dynamics affect the measured response. (LLM, conf=0.88)
- Not checked — no full text of the sourcecites [102] 2015, Spectral Mapping of Thermal Conductivity Through Nanoscale Ballistic Transport, Nat. Nanotechnol. source
- Not checked — no full text of the sourcecites [103] 1999, Thermal-Conductivity Measurements of GaAs/AlAs Superlattices Using a Picosecond Optical Pump-and-Probe Technique, Phys. Rev. B source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
In the paper
“When 𝑊 is equal to 0.5, which means the rear-side temperature reaches to one half of its maximum temperature, 𝜂 is equal to 1.38, and so the thermal diffusivity 𝛼 is calculated by [66]:”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [66] 1961, Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity, J. Appl. Phys. source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
- The authors state this as an assumption: In the laser flash method, heat conduction is assumed to be one-dimensional, with no lateral heat loss.
In the paper
“and an ultralow thermal conductivity as low as 0.004 W/m·K for ZrW2O8 at temperature 2 K [43].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [43] 2005, Unusual Thermal Conductivity of the Negative Thermal Expansion Material, ZrW2O8, Solid State Commun. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
- The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
- The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.
In the paper
“The measurement uncertainty reported by Maldonado is less than 3% [38].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
- The authors state this as an assumption: In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
- The authors state this as an assumption: In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.
In the paper
“If applied properly, it can achieve uncertainties below 1% for gases, liquids, and solids, and below 2% for nanofluids [51].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
What the sources say
- Not checked — no full text of the sourcecites [51] 2010, Historical Evolution of the Transient Hot-Wire Technique, Int. J. Thermophys. source
Strength:plain· not yet calibratedCausal:conditional· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
A result the paper reports from its own data — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“A clear phase difference is observed between the pulsed FDTR and the CW-based FDTR and attentions must be paid to adopt the correct solution when processing signals from different FDTR systems.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:boosted· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
In the paper
“Temperature increase at the sensor surface 𝛥𝑇 (e.g.1-3°C [56]) as a function of time can be measured.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
What the sources say
- Not checked — no full text of the sourcecites [56] 2013, Porous Mullite Ceramics With Low Thermal Conductivity Prepared by Foaming and Starch Consolidation, J. Porous Mater. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
- The authors state this as an assumption: In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Contact thermal resistance is a major source of error for temperature measurement.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✗ Based: failsProbably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The thermal conductivity of thin films also depends strongly on the materials preparation (processing) method, and the substrate that thin films are sitting on.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 1. Introduction
Strength:boosted· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The TPS measurement errors come from several sources: 1) thermal contact resistance between the sensor and the testing samples, 2) the thermal inertia of the sensor, 3) the measured power input being influenced by the heat capacity of the electrical isolation films, and 4) the electrical resistance change of the metallic disk sensors.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“In order to overcome the drawbacks associated with the steady-state methods described above such as parasitic heat losses, contact resistance of temperature sensors, and long waiting time for establishing steady-state temperature difference, a variety of transient techniques have been developed.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2 Transient technique
Tests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesProbably not a substantial claim.
In the paper
“The advantages of the method are not only its speed (usually 1-2 s for most solid), but also its capability to use very small samples, e.g.5-12 mm in diameter [53].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [53] 2011, Characterization Methodologies of Thermal Management Materials source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“The laser flash method is capable of measuring thermal conductivity over a wide temperature range (-120 °C to 2800 °C [71]) with measurement uncertainty reported to be less than 3% [72].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [71] 2015, Thermal-Diffusivity and Heat-Capacity Measurements of Sandstone at High Temperatures Using Laser Flash and DSC Methods, Int. J. Thermophys. source
- Not checked — no full text of the sourcecites [72] 2011, Considerations in the Use of the Laser Flash Method for Thermal Measurements of Thermal Interface Materials, IEEE Trans. Compon. Packag. Manuf. Technol. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“In addition to bare contacts, thermal interface materials (TIMs) are usually employed to reduce thermal contact resistance.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
In the paper
“Despite its advantages, there are very few commercial hot-wire instruments [52].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
What the sources say
- Not checked — no full text of the sourcecites [52] 2015, A Novel Portable Absolute Transient Hot-Wire Instrument for the Measurement of the Thermal Conductivity of Solids, Int. J. Thermophys. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“However, Eq. ( 5) is nonlinear and difficult to be solved analytically.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
Load-bearingStrength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“This technique is a derivative of the absolute technique in the steady-state methods, with the difference that a periodic electrical heating current 𝐼(𝑡) is used.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
In the paper
“Measurement accuracy of the temperature sensor (temperature resistance thermometer) is usually ± 0.01 °C [56].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.3 Transient plane source (TPS) method
What the sources say
- Not checked — no full text of the sourcecites [56] 2013, Porous Mullite Ceramics With Low Thermal Conductivity Prepared by Foaming and Starch Consolidation, J. Porous Mater. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
In the paper
“The rear-side infrared radiation thermometer should be fast enough to respond to the emitting signals, and the precision of temperature calibration is usually ± 0.2 K [53].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [53] 2011, Characterization Methodologies of Thermal Management Materials source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“This configuration is particularly practical where thermal conductivity is determined by a probe inserted in the test sample.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“When the thickness of a thin film is smaller than the mean free path of its heat carriers, which are electrons and phonons depending on whether the material is electrically conducting or not, the thermal conductivity of thin films is reduced compared to its bulk counterparts because of the geometric constraints.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 1. Introduction
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“2) the test usually suffers from a long waiting time, up to a few hours, to reach steady state.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
In the paper
“The parallel thermal conductance technique was introduced by Tritt et al [36] for small needle-like samples (e.g.2.0 × 0.05 × 0.1 mm 3 [36], 10 × 1 × 1 mm 3 [37]).”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.4 Parallel thermal conductance technique
What the sources say
- Not checked — no full text of the sourcecites [36] 2001, Description of the Parallel Thermal Conductance Technique for the Measurement of the Thermal Conductivity of Small Diameter Samples, Rev. Sci. Instrum. source
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In the paper
“The method was first introduced by Parker et al. [66].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not checked — no full text of the sourcecites [66] 1961, Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity, J. Appl. Phys. source
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The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“For thin films, the temperature drop across an interface can be attributed to the bonding strength and material difference.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 1. Introduction
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In the paper
“A small temperature gradient ∆𝑇 = 𝑇 ℎ -𝑇 𝑐 (usually ~0.3 K) is created between the heat source and the heat sink, which can be measured by a calibrated Au-Fe chromel thermocouple [38].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source
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The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“This is the most widely used method for axial heat flow thermal conductivity testing.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.2 Comparative technique
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In the paper
“Thermocouples are used predominantly for temperature sensing in radial heat flow method, with an accuracy within ±0.1 °C [34].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.3 Radial heat flow method
What the sources say
- Not matchedcites [34] ASTM, Standard Test Method for Steady-State Heat Transfer Properties of Pipe Insulation
Couldn’t be matched to a paper in Crossref, so it can’t be checked.
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
- Not matched
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“This technique is in principle very close to the Angstrom's method [39,40] in terms of the heating method.But the difference is that the heat sink temperature of this technique is slowly varying during the measurement.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
In the paper
“Pulsed power technique was first introduced by Maldonado to measure both thermal conductivity and thermoelectric power [38].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [38] 1992, Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures, Cryogenics source
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The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“It uses optical heating as an instantaneous heating source, along with a thermographic technique for quick non-invasive temperature sensing.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Working principle of the needle-probe method is same as the hot-wire method.But the temperature sensing is based on a zero radius system (i.e.𝑟 = 0 in Eq. ( 8)).”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
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The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The testing sample is usually a solid planar-shaped material when measuring thermal conductivity, and is a multi-layer structure when characterizing thermal contact resistance.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“This method has also been commonly used for measuring the thermal conductivity of liquids.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“We note that some techniques (e.g.3ω, TDTR and FDTR) are actually very versatile and can be applied for the thermal characterization of both bulk and thin film materials although the techniques reviewed here have been divided into two categories for bulk materials and thin films just for convenience.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > Transient (time-domain)
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In the paper
“The major challenge of the absolute technique is to determine the heat flow rate 𝑄 through the sample at the presence of parasitic heat losses 𝑄 loss and to measure temperature difference ∆𝑇 accurately.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
In the paper
“The one-dimensional steady-state testing method is widely used for characterizing the thermal conductivity of TIMs, as well as the thermal contact resistance [29].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
What the sources say
- Not matchedcites [29] ASTM, Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
Couldn’t be matched to a paper in Crossref, so it can’t be checked.
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
- Not matched
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The probe helps protect the heating wire.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“This method is usually used to characterize low thermal conductivity materials, such as building insulation materials.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.2 Comparative technique
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None of the sources cited for this claim could be matched to a paper in Crossref, so there is nothing to check it against.
In the paper
“ASTM E1461 [69] and ISO 22007-4 [70] specify the requirements of apparatus, test sample and procedure for thermal diffusivity measurement by the laser flash method.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
What the sources say
- Not matchedcites [69] ASTM, Standard Test Method for Thermal Diffusivity by the Flash Method
Couldn’t be matched to a paper in Crossref, so it can’t be checked.
- Not matchedcites [70] ISO, Plastics—Determination of Thermal Conductivity and Thermal Diffusivity—Part 4: Laser Flash Method
Couldn’t be matched to a paper in Crossref, so it can’t be checked.
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
- Not matched
In the paper
“A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements [53].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
What the sources say
- Not checked — no full text of the sourcecites [53] 2011, Characterization Methodologies of Thermal Management Materials source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The needle-probe method, also for testing isotropic and homogeneous materials, is a variation of the hot-wire method.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“Though laser flash method can be used to measure thin films, thickness of the measured sample is limited by the timescales associated with the heating pulse and the infrared detector.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.4 Laser flash method for thermal diffusivity
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
In the paper
“The heating current used can be either a square wave of constant-amplitude current or a sinusoid wave [41].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.1 Pulsed power technique
What the sources say
- Not checked — no full text of the sourcecites [41] 2014, Thermal, Vibrational, and Thermoelastic Properties of Y2Mo3O12 and Their Relations to Negative Thermal Expansion, Phys. Rev. B source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
None of the sources cited for this claim have been checked yet.
In the paper
“Hot-wire method is commonly used to measure low thermal conductivity materials such as soils [46], ice cores [47] and refractories (refractory brick, refractory fibers, plastic refractories and powdered materials [48]).”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
What the sources say
- Not checked — no full text of the sourcecites [46] 2001, A Comparison of Two Methods Used to Evaluate Thermal Conductivity for Some Soils, Int. J. Heat Mass Transfer source
- Not checked yetcites [47] 1999, Apparatus for Routine Measurements of the Thermal Conductivity of Ice Cores, Ann. Glaciol. source
Checked before — its earlier verdict is held back until a new check runs.
- Not matchedcites [48] ASTM, Standard Test Method for Thermal Conductivity of Refractories by Hot Wire (Platinum Resistance Thermometer Technique)
Couldn’t be matched to a paper in Crossref, so it can’t be checked.
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The thermal conductivity of thin films is in general anisotropic due to the geometric constraints, which means that the value are different in different directions (i.e.in-plane thermal conductivity 𝑘 ∥ , and cross-plane thermal conductivity 𝑘 ⊥ ).”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 1. Introduction
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A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“Resistance thermometers (i.e.RTDs) [24,25] and infrared (IR) thermography [26] are often employed for temperature sensing when testing small samples (in micron scale or even smaller) by using absolute technique.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.1.1 Absolute technique
What the sources say
- Not checked — no full text of the sourcecites [24] 2003, Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device, ASME J. Heat Transfer source
- Not checked — no full text of the sourcecites [25] 2009, Direct Measurement of Thermal Conductivity of Aluminum Nanowires, Appl. Phys. Lett. source
- Not checked — no full text of the sourcecites [26] 2011, Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites With High Packing Density, ACS Nano source
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In the paper
“In order to increase measurement accuracy, Volklein et al. [74] concluded that it is desirable to have the product of the thin film in-plane thermal conductivity 𝑘 𝑓,∥ and film thickness 𝑑 𝑓 equal to or greater than the corresponding product of the substrate (i.e.𝑘 𝑓,∥ 𝑑 𝑓 ≥ 𝑘 𝑆 𝑑 𝑆 ).”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.1.2 In-plane thermal conductivity measurement
What the sources say
- Not checked — no full text of the sourcecites [74] 2011, Thermal Conductivity Anisotropy and Grain Structure in Ge2Sb2Te5 Films, J. Appl. Phys. source
Tests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesProbably not a substantial claim.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Therefore, the method is conveniently applied to powder-like materials and soils.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 2.2.2 Hot-wire method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“FDTR system can also be implemented using the less expensive continuous wave (CW) lasers as shown in Figure 14b, which achieves similar accuracy to TDTR measurement for thermal conductivity of many thin-film materials [98,105,106,109].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
What the sources say
- Not checked — no full text of the sourcecites [98] 2008, Pulse Accumulation, Radial Heat Conduction, and Anisotropic Thermal Conductivity in Pump-Probe Transient Thermoreflectance, Rev. Sci. Instrum. source
- Not checked — no full text of the sourcecites [105] 2011, Optical Measurement of Thermal Conductivity Using Fiber Aligned Frequency Domain Thermoreflectance, ASME J. Heat Transfer source
- Not checked — no full text of the sourcecites [106] 2013, Pump-Probe Thermoreflectance, Annu. Rev. Heat Transfer source
- Not checked — no full text of the sourcecites [109] 2014, Nonlocal Theory for Heat Transport at High Frequencies, Phys. Rev. B source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The 3ω method has also been extensively used to measure the in-plane thermal conductivity of thin films.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
Strength:boosted· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“With the advancement of pico-and femtosecond pulsed laser after 1980, this technique has been widely used for studying non-equilibrium electron-phonon interaction [89,90], detecting coherent phonon transport [91][92][93] and thermal transport across interfaces [94][95][96] .”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
What the sources say
- Not checked — no full text of the sourcecites [89] 2013, Two-Channel Model for Nonequilibrium Thermal Transport in Pump-Probe Experiments, Phys. Rev. B source
- Not checked — no full text of the sourcecites [90] 1992, Coherent Phonon Detection From Ultrafast Surface Vibrations, Phys. Rev. Lett. source
- Not checked — no full text of the sourcecites [91] 2012, Coherent Phonon Heat Conduction in Superlattices, Science source
- Not checked — no full text of the sourcecites [92] 2014, Crossover From Incoherent to Coherent Phonon Scattering in Epitaxial Oxide Superlattices, Nat. Mater. source
- Not checked — no full text of the sourcecites [93] 2004, Analysis of Heat Flow in Layered Structures for Time-Domain Thermoreflectance, Rev. Sci. Instrum. source
- Not checked — no full text of the sourcecites [94] 2008, Probing the Gold Nanorod−Ligand−Solvent Interface by Plasmonic Absorption and Thermal Decay, J. Phys. Chem. C source
- Not checked — no full text of the sourcecites [95] 2006, Thermal Conductance of Hydrophilic and Hydrophobic Interfaces, Phys. Rev. Lett. source
- Not checked — no full text of the sourcecites [96] 2009, A Frequency-Domain Thermoreflectance Method for the Characterization of Thermal Properties, Rev. Sci. Instrum. source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“Optical heating and sensing method (e.g.transient thermoreflectance technique), on the other hand, usually requires minimal sample preparation.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
None of the sources cited for this claim have been checked yet.
In the paper
“The 3ω method is widely used to measure thermal properties of both bulk materials and thin films after it was first introduced in 1990 by Cahill and coworkers [78,79].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
What the sources say
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“In practice, 𝑘 𝑓,⊥ is usually measured first with a heater/sensor with much greater width that is only sensitive to cross-plane thermal conductivity.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
None of the sources cited for this claim have been checked yet.
In the paper
“For electrically conducting and semiconducting materials, samples need to be electrically isolated from the metallic heater/sensor with additional insulating layer [80,86], which introduces extra thermal resistance and inevitably reduces both sensitivity and measurement accuracy.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
What the sources say
- Not checked yetcites [80] 2006, Thermal Conductivity Measurement by the 3 Omega Method
- Not checked — no full text of the sourcecites [86] 1982, Thermal-Wave Imaging, Science source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The transient thermoreflectance technique is a non-contact optical heating and sensing method to measure thermal properties (thermal conductivity, heat capacity, and interfacial thermal conductance) of both bulk and thin film materials.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“The challenge of thermoreflectance technique lies in its versatile capability that multiple thermal properties including thermal conductivity, interfacial thermal conductance and heat capacity can be determined depending on the measurement regime.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
None of the sources cited for this claim have been checked yet.
In the paper
“Dames also described the general case of thermal and electrical transfer functions framework [82].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
What the sources say
- Not checked yetcites [82] 2003, Nanoscale Thermal Transport, J. Appl. Phys. source
Checked before — its earlier verdict is held back until a new check runs.
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
- Not checked yet
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“Another challenge is that the 3ω method involves microfabrication for the metallic heater/sensor.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.1 3ω method
Strength:plain· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“At high frequency limit, the penetration depth 𝐿 𝑝,𝑧 would be so small that temperature gradient only penetrates into a limited depth of the layer (referred to as”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Tests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesThe quote only partly states this claim.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Different from bulk samples whose thickness is always much longer than the cross-plane penetration depth, the thickness of a thin film might be comparable or even smaller than the cross-plane penetration depth 𝐿 𝑝,𝑧 .”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Load-bearingStrength:hedged· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✓ Load-bearing: passes✓ Based: passesIt may state two separate claims as one.
None of the sources cited for this claim have been checked yet.
In the paper
“TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary[95,117,118] and solid-solid interfaces[119], interfacial thermal conductance between metals and dielectrics,[120][121][122][123][124] and interface between low dim”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
What the sources say
- Not checked — no full text of the sourcecites [95] 2006, Thermal Conductance of Hydrophilic and Hydrophobic Interfaces, Phys. Rev. Lett. source
- Not checked yetcites [117] 2013, The Influence of Interface Bonding on Thermal Transport Through Solid–Liquid Interfaces, Appl. Phys. Lett. source
- Not checked yetcites [118] 2012, Effects of Chemical Bonding on Heat Transport Across Interfaces, Nat. Mater. source
- Not checked — no full text of the sourcecites [119] 2006, Thermal Conductance of Interfaces Between Highly Dissimilar Materials, Phys. Rev. B source
- Not checked — no full text of the sourcecites [120] 2003, Thermal Conductance of Epitaxial Interfaces, Phys. Rev. B source
- Not checked — no full text of the sourcecites [121] 2015, Thermal Transport Through GaN–SiC Interfaces From 300 to 600 K, Appl. Phys. Lett. source
- Not checked — no full text of the sourcecites [122] 2014, Thermal Boundary Conductance Across Metal-Gallium Nitride Interfaces From 80 to 450 K, Appl. Phys. Lett. source
- Not checked — no full text of the sourcecites [123] 2016, Thermal Interface Conductance Across Metal Alloy–Dielectric Interfaces, Phys. Rev. B source
- Not checked — no full text of the sourcecites [124] 2003, Interfacial Heat Flow in Carbon Nanotube Suspensions, Nat. Mater. source
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“Nevertheless, the most effective way to deal with radiation heat loss would be using a transient heating (e.g.use alternating current) and temperature sensing technique such as the 3ω method.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.1.2 In-plane thermal conductivity measurement
Strength:hedged· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✗ Based: failsProbably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.
A claim is checked only against the cited paper’s full text, never its abstract, and none is available for its sources.
In the paper
“The thermoreflectance technique was primarily developed in the 1970s and 1980s when continuous wave (CW) light sources are used to heat the sample [87,88].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
What the sources say
Strength:plain· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“To minimize heat loss to the ambient, the experimental measurement is usually carried out under vacuum.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.1.2 In-plane thermal conductivity measurement
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Usually a small temperature difference is used to minimize the radiation heat loss while coating the surface with low-emissivity material could be another option.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.1.2 In-plane thermal conductivity measurement
Strength:hedged· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it. It may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Samples are usually coated with a metal thin film (e.g.Aluminum or Tungsten), referred to as metallic transducer layer, whose reflectance changes with the temperature rise at the laser wavelength.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The other group of thermoreflectance technique is FDTR, where the thermoreflectance change is measured as a function of the modulation frequency of the pump beam.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“The TDTR method measures the thermoreflectance response as a function of the time delay between the arrival of the probe and the pump pulses at the sample surface.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
In the paper
“However, in order to completely remove parasitic heat loss through the substrate, a suspended structure by removing the substrate as shown in Figure 9 is desirable, which complicates microfabrication for sample preparation [75].”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.1.2 In-plane thermal conductivity measurement
What the sources say
- Not checked — no full text of the sourcecites [75] 1990, Thermal Conductivity and Diffusivity of a Thin Film SiO2-Si3N4 Sandwich System, Thin Solid Films source
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“In general, it is a very challenging task to determine material thermal conductivity and interface contact resistance with less than 5% error.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✗ Based: failsProbably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“For thermal characterization of bulk material, the steady-state absolute method, comparative technique, laser flash diffusivity method, and transient plane source (TPS) method are most used.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✗ Based: failsProbably not a substantial claim. The paper’s conclusions may not depend on it. The paper may give no reason why it holds.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“If a very low modulation frequency and small spot size is used to conduct TDTR measurement, the radial heat transfer dominates the thermal dissipation (Figure20a), and the signal is determined by the geometric average thermal conductivity √𝑘 𝑟 𝑘 𝑧 .”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:direct· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
The paper states this without a source or data behind it here, so there is nothing to check it against. The quote shows it is in the paper.
In the paper
“Note that the steady-state methods for bulk materials including absolute technique, comparative technique and radial heat flow method.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > Additional information
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“For thin film measurement, the 3ω method and transient thermoreflectance technique are employed widely.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes✗ Load-bearing: fails✓ Based: passesProbably not a substantial claim. The paper’s conclusions may not depend on it.
A conclusion the paper draws from its own results — it cites no other source for it, so there is none to check. The quote shows it is in the paper.
In the paper
“The absolute technique and comparative technique measure large-size sample but need longest time for data acquisition, while transient thermoreflectance technique is capable of measuring thinnest film sample in a quickest way.”
- Also stated in: § Additional information · plain
“The state-state methods for bulk materials measure large-size sample but need longest time for data acquisition, while transient thermoreflectance technique (TDTR and FDTR) is capable of measuring thinnest film sample in a quickest way.”
§ Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials > 3.2.2 Transient thermoreflectance technique
Strength:plain· not yet calibratedCausal:correlational· not yet calibratedTests✓ Asserted: passes✓ Checkable: passes? Load-bearing: unclear✓ Based: passesIt may state two separate claims as one.
- Also stated in: § Additional information · plain
The authors state this as an assumption.
In the absolute technique for thermal contact resistance, the temperature distribution on each side of the mating samples is linear.
“Temperatures at both interfaces (i.e.𝑇 ℎ and 𝑇 𝑐 , denoted by hollow circles) can be deduced assuming the temperature distribution on each side is linear.”
The authors state this as an assumption.
In the pulsed power technique, using C(Tc), R(Tc) and K(Tc) in place of C(Th), R(Th) and K((Th+Tc)/2) is valid because the temperature difference between Tc and Th is very small.
“Therefore, 𝐶(𝑇 𝑐 ) , 𝑅(𝑇 𝑐 ) and 𝐾(𝑇 𝑐 ) are usually used in Eq. ( 5) to replace 𝐶(𝑇 ℎ ) , 𝑅(𝑇 ℎ ) and 𝐾((𝑇 ℎ + 𝑇 𝑐 )/2) to linearize the equation.This assumption holds because temperature difference between 𝑇 𝑐 and 𝑇 ℎ (i.e.∆𝑇) is very small (Figure 4b).”
The authors state this as an assumption.
In the pulsed power technique, Tc is considered constant because it drifts very slowly compared to the periodic current.
“Also, 𝑇 𝑐 is considered to be constant since it is drifted very slowly compared to the periodic current.”
The authors state this as an assumption.
In the TPS method, the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process because the time period is generally only a few seconds.
“This time period is generally only a few seconds so that the metal disk can be considered in contact with infinite size samples throughout the transient signal recording process.”
The authors state this as an assumption.
In the laser flash method, heat conduction is assumed to be one-dimensional, with no lateral heat loss.
“Heat conduction is assumed to be one-dimensional (i.e.no lateral heat loss).”
The authors state this as an assumption.
The temperature at the top of the film is the same as the average heater temperature.
“The temperature at the top of the film 𝑇 𝑓,1 is generally assumed to be the same as the average heater temperature 𝑇 ℎ .”
The authors state this as an assumption.
The temperature at the upper side of the film can be taken to be equal to the heater/sensor temperature because contact resistances are very small.
“The temperature at the upper side of the film is usually taken to be equal to the heater/sensor temperature because the contact resistances are typically very small, 10 -8 -10 -7 m 2 K/W [83].”
The authors state this as an assumption.
Heat conduction across the thin film is one-dimensional.
“Assuming one-dimensional heat conduction across the thin film (Figure 10a), the thermal conductivity of the thin film can be easily determined from:”
The authors state this as an assumption.
The boundary condition is approximately adiabatic under experimental conditions.
“The boundary condition is approximately adiabatic in experimental condition, hence 𝐹 𝑏 = 𝐶𝜃 𝑡 + 𝐷𝐹 𝑡 = 0”
The authors state this as an assumption.
The material is isotropic when determining thermal conductivity with a small beam spot at low frequency and heat capacity with a large beam spot at high frequency.
“If we assume the material isotropic, we can first determine thermal conductivity using a small beam spot at low frequency, and then measure heat capacity using a large beam spot at high frequency.”
The authors state this as an assumption.
The in-plane thermal conductivity has cylindrical symmetry when using a small spot size to measure in-plane thermal conductivity.
“This method of measuring in-plane thermal conductivity using a small spot size, however, assumes cylindrical symmetry of thermal conductivity in the in-plane direction [94].”
The authors state this as an assumption.
The heat flow is one-dimensional with no lateral heat loss.
“The heat flow is assumed to be one-dimensional with no lateral heat loss.”
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
Each contradiction between two passages listed here was confirmed by an independent check.
Heater resistance is identified as thermal resistance
MinorIn the pulsed-power derivation, the heater resistance is introduced as electrical resistance, while the explanation of the resulting expression calls R thermal resistance. The R multiplied by current squared in that expression must be the electrical heater resistance described earlier.
“where 𝜏 is the half period of the heating current, 𝐶 is the volumetric heat capacity, R is thermal resistance and 𝐼 0 is the amplitude of electric current.”
“where 𝑅 𝑒 (𝑇 ℎ ) is the electrical resistance of the heater which changes with temperature.”
Interfacial conductance and contact resistance use different heat quantities
MinorThe paper defines interfacial conductance using heat flux, but defines thermal contact resistance using total heat flow and says the two are inverses. The reciprocal of the stated resistance uses total heat flow, not heat flux; the definitions differ by interface area.
“Interfacial thermal conductance (denoted as 𝐾 or 𝐺 ) is defined as the ratio of heat flux to temperature drop across the interface of two components.”
“The thermal contact resistance is then calculated by the temperature drop (i.e.𝑇 ℎ -𝑇 𝑐 ) divided by total heat flow across the interface.”
Reference [32] identifies a different source
MinorThe text cites [32] for the ASTM E1530 standard, but reference 32 is a work by Flynn. The ASTM E1530 entry is numbered 31 in the reference list.
“ASTM C518 [31], ASTM E1530 [32] and European Standard EN 12667 [22] specify the test apparatus and calibration method for heat flow meter method.”
“31. ASTM E1530-11 Standard Test Method for Evaluating the Resistance to Thermal Transmission of Materials by the Guarded Heat Flow Meter Technique. 32. Flynn, D. R. in Compendium of Thermophysical Property Measurement Methods”
Equation 27 is described as normalized although it gives a temperature drop
MinorThe text first presents Eq. (27) as the thin-film temperature drop ΔTf, then says the equation gives that drop normalized to a one-dimensional value. The displayed equation has no normalization by that value.
“Eq. ( 27) gives the temperature drop of thin film normalized to the value for purely onedimensional heat conduction through the film”
“The temperature drop across the thin film is obtained as [13]: ∆𝑇 𝑓 = 𝑝 𝜋𝐿 ( 1 𝑘 𝑓,⊥ 𝑘 𝑓,∥ ) 1/2 ∫ 𝑠𝑖𝑛 2 𝜆 𝜆 3 𝑡𝑎𝑛ℎ [𝜆 ( 𝑑 𝑓 𝑎 ) ( 𝑘 𝑓,∥ 𝑘 𝑓,⊥ ) 1/2 ] ∞ 0 𝑑𝜆 (27”
Citations
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MethodInfluential
Flagged first, then by citations
Research works printed but not linked: 2
- 2006, Materials Science in Microelectronics: The Relationships Between Thin Film Processing and Structure
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Metadata
- Authors
- Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R.
- Affiliations
- University of Colorado Boulder (US)
- Venue
- Journal of Electronic Packaging
- Publisher
- ASME International
- Published
- 2016-10-06
- Volume
- 138
- Issue
- 4
- ISSN
- 1043-7398 (ISSN-L)
- 1528-9044
- OpenAlex
- W2399632194
- Cited by
- 559
- References
- 133
- Citations by year
- 2026: 55 · 2025: 72 · 2024: 60 · 2023: 57 · 2022: 72 · 2021: 59 · 2020: 66 · 2019: 56 · 2018: 41 · 2017: 19 · 2016: 2
- FWCI
- 15.14
- Type
- journal article
- Language
- en
- Open access
- green
- arxiv.org
- Locations
- Journal of Electronic Packaging (publishedVersion)
- arXiv (Cornell University) (submittedVersion)
- arXiv (Cornell University)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- thermal conductivity measurement, interfacial thermal conductance, thin films, bulk materials, steady-state method, transient hot-wire method, transient plane source, 3ω method, transient thermoreflectance, measurement error sources
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